background image
MICROFILM
SERVICE MANUAL
FM/MW/LW CASSETTE CAR STEREO
AEP Model
UK Model
Model Name Using Similar Mechanism
XR-5800R
Tape Transport Mechanism Type
MG-25G-136
SPECIFICATIONS
XR-C4100


background image
­ 2 ­
TABLE OF CONTENTS
1.
GENERAL
Location of Controls ....................................................... 3
Resetting the Unit ........................................................... 4
Detaching the Front Panel ............................................... 4
Preparing the Rotary Commander .................................. 4
Setting the Clock ............................................................. 4
Installation ....................................................................... 5
Connections ..................................................................... 6
2.
DISASSEMBLY ......................................................... 9
3.
ASSEMBLY OF MECHANISM DECK ........... 11
4.
MECHANICAL ADJUSTMENTS ....................... 14
5.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 14
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
6.
DIAGRAMS
6-1. IC Pin Function Description ........................................... 18
6-2. Printed Wiring Boards ­MAIN Section­ ....................... 21
6-3. Schematic Diagram ­MAIN Section­ ........................... 25
6-4. Printed Wiring Board ­PANEL Section­ ...................... 29
6-5. Schematic Diagram ­PANEL Section­ ......................... 31
7.
EXPLODED VIEWS ................................................ 35
8.
ELECTRICAL PARTS LIST ............................... 38
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 ° C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.


background image
­ 3 ­
SECTION 1
GENERAL
This section is extracted from
instruction manual.


background image
­ 4 ­


background image
­ 5 ­