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SERVICE MANUAL
FM/MW/SW CASSETTE CAR STEREO
E Model
Model Name Using Similar Mechanism
XR-C5100
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-4950X/4954X
Photo: XR-4950X
Ver 1.1 2001.05
9-870-103-12
Sony Corporation
2001E0500-1
e Vehicle Company
C
2001.5
Shinagawa Tec Service Manual Production Group


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TABLE OF CONTENTS
1. SERVICE NOTE ............................................................. 2
2. GENERAL ........................................................................ 3
3. DISASSEMBLY .............................................................. 13
4. ASSEMBLY OF MECHANISM DECK ................ 14
5. MECHANICAL ADJUSTMENTS ............................ 17
6. ELECTRICAL ADJUSTMENTS
6-1. Test Mode ........................................................................ 17
· Tape Deck Section ........................................................ 17
· Tuner Section ................................................................ 17
7.
DIAGRAMS
7-1. Block Diagrams
· TUNER/TAPE/MAIN Section ..................................... 18
· DISPLAY/KEY CONTROL/BUS CONTROL/
POWER SUPPLY Section ........................................... 19
7-2. Printed Wiring Board ­ MAIN Board ­ ......................... 21
7-3. Schematic Diagram ­ MAIN Board (1/2) ­ ................... 22
7-4. Schematic Diagram ­ MAIN Board (2/2) ­ ................... 23
7-5. Printed Wiring Boards ­ KEY/SUB Boards ­ .............. 24
7-6. Schematic Diagrams ­ KEY/SUB Boards ­ .................. 25
7-7. IC Block Diagrams ......................................................... 26
7-8. IC Pin Function ............................................................... 27
8.
EXPLODED VIEWS ................................................ 32
9.
ELECTRICAL PARTS LIST ............................... 35
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SECTION 1
SERVICE NOTE
SUB board
Front panel assembly
Please press on the sub board from above when checking it.
This assures that the connector does not lose contact.


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SECTION 2
GENERAL
This section is extracted from
instruction manual.


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