MZ-E33
SERVICE MANUAL
PORTABLE MINIDISC PLAYER
SPECIFICATIONS
US Model
Canadian Model
AEP Model
E Model
Model Name Using Similar Mechanism
MZ-E55
MD Mechanism Type
MT-MZE55-150
Optical Pick-up Mechanism Type
ODX-1A/1B
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.
System
Audio playing system
MiniDisc digital audio system
Laser diode properties
Material : GaAlAs
Wavelength :
=790 nm
Emission duration : continuous
Laser output : less than 44.6
µW*
* This output is the value measured at a distance of 200 mm from the
objective lens surface on the optical pick-up block with 7 mm aperture.
Revolutions
400 rpm to 900 rpm (CLV)
Error correction
Advanced Cross Interleave Reed Solomon Code (ACIRC)
Sampling frequency
44.1kHz
Coding
Adaptive TRansform Acoustic Coding (ATRAC)
Modulation system
EFM (Eight to Fourteen Modulation)
Number of channels
2 stereo channels
1 monaural channel
Frequency response
20 to 20,000 Hz ± 3 dB
Wow and Flutter
Below measurable limit
Outputs
Headphones : stereo mini-jack, maximum output level 5mW+5mW,
load impedance 16 ohm
General
Power requirements
One LR6 (size AA) alkaline battery (not supplied)
Ni-MH rechargeable battery NH-9WM/NH-14WM
(not supplied)
R-6 sized Ni-MH rechargeable battery NH-MDAA (supplied)
Sony AC Power Adaptor AC-MZR55 (supplied) connected at the
DC IN 3V jack
Battery operation time
Batteries
Playback
LR6 (SG) (size AA)
Approx. 9.5 hours
Sony alkaline battery
R-6 sized Ni-MH
Approx. 8 hours
rechargeable battery
NH-MDAA
Chewing gum type
Approx. 7 hours
Ni-MH rechargeable
battery NH-14WM
Chewing gum type
Approx. 6.5 hours
Ni-MH rechargeable
battery NH-9WM (N)
Dimensions
Approx. 80
× 17.3 × 92 mm (w/h/d)
(3 1/4
× 11/16 × 3 5/8 in.)
not including projecting parts and controls
MICROFILM
Continued on next page
2
1. SERVICING NOTE ....................................................... 3
2. GENERAL ....................................................................... 4
3. DISASSEMBLY
3-1. Bottom Panel Assy .............................................................. 5
3-2. Upper Panel Assy ................................................................ 5
3-3. Main Board ......................................................................... 6
3-4. MD Assy ............................................................................. 6
3-5. OP Service Assy .................................................................. 6
4. TEST MODE ................................................................... 7
5. ELECTRICAL ADJUSTMENTS ............................ 11
6. DIAGRAMS
6-1. IC Pin Description ............................................................. 13
6-2. Block Diagram .................................................................. 15
6-3. Printed Wiring Board ........................................................ 18
6-4. Schematic Diagram ........................................................... 21
7. EXPLODED VIEWS
7-1. Panel Section ..................................................................... 29
7-2. Main Board Section .......................................................... 30
7-3. Mechanism Deck Section .................................................. 31
8. ELECTRICAL PARTS LIST .................................... 32
TABLE OF CONTENTS
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270°C during
repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENTAL OR CONSEQUENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OF ANY PRODUCT.
"MD WALKMAN" is a trademark of Sony
Corporation.
This MiniDisc player is classi-
fied as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on
the bottom exterior.
Mass
Approx. 113 g (4.0 oz.) the player only
Approx. 155 g (5.5 oz.) incl. a premastered MD and a Sony
alkaline LR6 (SG) battery
Supplied accessories
AC power adaptor AC-MZR55 (1)
R-6 sized Ni-MH rechargeable battery NH-MDAA (1)
Rechargeable battery carrying case (1)
Headphones with a remote control
MDR-A34SP + RM-MZE33 (1) (US model)
MDR-E805SP + RM-MZE33 (1) (Canadian, AEP, E model)
MDR-E838SP + RM-MZE33 (1) (Hong Kong model)
Carrying pouch (1)
Design and specifications are subject to change without notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED LINE
WITH MARK
! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
! SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
3
SECTION 1
SERVICING NOTE
1. When repairing this device with the power on, if you remove the main board, this device stops working.
In this case, you work without the device stopping by fastening the hook of the DOOR OPEN/CLOSE switch (S801) with tape.
S801
2. The electrical components differ according to the version of the system control IC (IC801). When replacing the IC801, check its model
name and add or remove D1001 and/or R1001 as shown below. For detailed information, see the Printed Wiring Board on page 18 and
the Schematic Diagram on page 21.
RU6815MF-0004 (Ver. 3.0) .... Add D1001 and R1001
RU6815MF-0005 (Ver. 3.2) and later .... Remove D1001 and R1001