1
Ver 1.1 2002. 04
Model Name Using Similar Mechanism
NEW
Mini Disc Mechanism Type
MG-798LP-133
Optical Pick-up Name
KMS-241C/J1N
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
MDX-66XLP
SPECIFICATIONS
System
Mini disc digital audio system
Frequency response
10 20,000 Hz
Wow and flutter
Below measurable limit
Signal-to-noise ratio
95 dB
Outputs
Bus control output (8 PIN)
Analog audio output (RCA PIN)
Current drain
300 mA (MD playback)
600 mA (during loading or
ejecting a disc)
Dimensions
Approx. 176
× 83.5 × 142 mm
(7
× 3 3/8 × 5 18/32 in.) (w/h/d)
not incl.
projecting parts and controls
Mass
Approx. 1.1 kg (2 lb. 7 oz.)
Power requirement
12 V DC car battery (negative
ground)
Supplied accessories
Mounting hardware (1 set)
Bus cable 5.5 m (1)
RCA pin cord 5.5 m (1)
· U.S. and foreign patents licensed from Dolby
Laboratories.
· Design and specifications are subject to change without
notice.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-873-582-02
2002D0400-1
© 2002. 04
MINIDISC CHANGER
FEATURES
· MDLP (MiniDisc Long Play) playback.
· Sony BUS system compatible with mobile MD
changers.
· Direct-in system for inserting and removing
MDs easily.
·The MD changer compartment has a built in light
for easy use even in the dark.
·1 bit Digital/Analog converter for high quality
sound reproduction.
2
MDX-66XLP
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. To Place the Set into Playback Mode .................................. 3
1-2. How to Check the Servo Board Waveforms ........................ 3
2. GENERAL
Preparations (US, Canadian Model) ........................................ 4
Connections (US, Canadian Model) ........................................ 4
Preparations (AEP, UK Model) ............................................... 5
Connections (AEP, UK Model) ............................................... 5
3. DISASSEMBLY
3-1. Panel (Rear) Assy ................................................................ 6
3-2. Case (Upper) ....................................................................... 7
3-3. Panel (Front) Assy ............................................................... 7
3-4. MD Block ............................................................................ 8
3-5. Main Board ......................................................................... 8
3-6. Chassis (OP) Block ............................................................. 9
3-7. Servo Board ......................................................................... 9
3-8. Optical Pick-up ................................................................. 10
3-9. Note on Assembly for the Chassis (OP) Block ................. 11
4. DIAGRAMS
4-1. IC Pin Descriptions ........................................................... 12
4-2. Block Diagram .................................................................. 18
4-3. Circuit Boards Location .................................................... 19
4-4. Printed Wiring Boards Servo Section ............................ 20
4-5. Schematic Diagram Servo Section ................................ 22
4-6. Schematic Diagram Main Section ................................. 23
4-7. Printed Wiring Boards Main Section ............................ 24
4-8. Printed Wiring Board Power Section ............................ 26
4-9. Schematic Diagram Power Section ............................... 27
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 30
5-2. Main Board Section .......................................................... 31
5-3. MD Section (1) .................................................................. 32
5-4. MD Section (2) .................................................................. 33
5-5. MD Section (3) .................................................................. 34
6. ELECTRICAL PARTS LIST ........................................ 35
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
laser-tap
OPTICAL PICK-UP FLEXIBLE BOARD
Notes on Chip Component Replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-241C/J1N)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The
flexible board is easily damaged and should be handled with care.
CLASS
PRODUCT
LASER
1
This label is located on the bottom of the chassis.
AEP, UK model
US, Canadian model
Ver 1.1
3
MDX-66XLP
1-1. TO PLACE THE SET INTO PLAYBACK MODE
The this set has no key control function and cannot be placed into
the Playback mode alone.
For key control, the this set is controlled through serial
communication with a master unit (car audio player, TV tuner or
source selector compatible with the Sony BUS system.)
To service the this set, the set should be connected as given below:
SECTION 1
SERVICE NOTE
1-2. HOW TO CHECK THE SERVO BOARD
WAVEFORMS
1. Remove the panel (rear) assy, case (upper) and panel (front) assy.
Then, remove the main board from the mechanism deck. (See
page 8 of "SECTION 3. DISASSEMBLY".)
2. Remove the chassis (OP) block from the mechanism deck. (See
page 9 of "SECTION 3. DISASSEMBLY".)
3. Short each bridge points BP1 and BP2 on the main board by
solder bridge.
4. Connect the power board with the main board by the main
flexible board. Connect the main board with the servo board by
the servo flexible board.
5. Connect to a master unit. With the master unit OFF, press the
preset buttons 4
t 5 t 1 (2 seconds or more each) in this
turn to enter the TEST mode.
6. Open the doors and insert a disc in the chassis (OP) assy. Use the
SOURCE button on the master unit to select to MD to
playback.
7. Check the waveforms at each point on the servo board.
Note: After this check is completed, remove solder between shorted
bridge points BP1 and BP2 and open these points.
MDX-66XLP
Master unit
BUS CONTROL IN
BUS CONTROL OUT
BP1
BP2
main board (conductor side)
4
MDX-66XLP
SECTION 2
GENERAL
This section is extracted
from instruction manual.
PREPARATIONS (US, Canadian Model)
CONNECTIONS (US, Canadian Model)
5
MDX-66XLP
PREPARATIONS (AEP, UK Model)
CONNECTIONS (AEP, UK Model)