US Model
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CORDLESS STEREO HEADPHONES
SPECIFICATIONS
MDR-IF8000
Ver 1.1 2002.03
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-873-527-02
2002C0200-1
© 2002.03
·
MDR-IF8000 is the component model block one in
MDR-DS8000.
COMPONENT MODEL NAME FOR MDR-DS8000
DIGITAL SURROUND PROCESSOR
DP-IF8000
CORDLESS STEREO HEADPHONES
MDR-IF8000
SERVICE MANUAL
Playback frequency range
12 24,000 Hz
Power requirements
Rechargeable nickel metal hydride
batteries (supplied or sold separately)
or R6 (size AA) alkaline batteries
Mass
Approx.350 g (10 oz)(including the
supplied rechargable nickel-metal
hydride batteries)
2
MDR-IF8000
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of soldering iron around 270°C during
repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Repair MDR-IF8000 and DP-IF8000 in a pair.
TABLE OF CONTENTS
1. GENERAL .......................................................................... 2
2. DISASSEMBLY
2-1. Hanger (R) .......................................................................... 3
2-2. VOL Board, RX1 Board, RX2 Board ................................. 3
2-3. PD1 Board ........................................................................... 4
2-4. Driver ASSY (SP31) (R-ch Section),
DriverASSY (SP11) (L-ch Section) ..................................... 4
2-5. Hanger (L), Headband (R) ASSY, Headband (F) ASSY,
SW Board ............................................................................ 5
3. ELECTRICAL ADJUSTMENTS ................................. 6
4. DIAGRAMS
4-1. Block Diagrams ................................................................... 7
4-2. Printed Wiring Board RX1 Section ............................... 8
4-3. Schematic Diagram RX1 Section ................................. 9
4-4. Printed Wiring Board RX2 Section ............................ 10
4-5. Schematic Diagram RX2 Section (1/2) ....................... 11
4-6. Schematic Diagram RX2 Section (2/2) ....................... 12
5. EXPLODED VIEWS
5-1. Driver Section .................................................................... 14
5-2. Hanger Section .................................................................. 15
6. ELECTRICAL PARTS LIST ........................................16
1
Infrared sensor
There are infrared sensors in two
locations on both sides.
2
Battery case
Press and lift up the lid to open it. This
battery case is for the supplied
rechargeable batteries and R6 (size AA)
alkaline batteries only.
3
Self-adjusting band
The headphones automatically turn on
when you put on the headphones.
4
POWER indicator
By pulling up the self-adjusting band, the
indicator lights red when battery power
is sufficient.
1
2
3
4
6
7
1
8
9
5
5
RESET button (See page 21 for
details)
Use to reset the location information of
the head tracking function.
6
HEAD TRACKING switch (See page
21 for details)
To activate the head tracking function,
switch it to ON when the output mode of
the processor is set to VIRTUAL (other
than OFF).
7
VOL (Volume) control
Use to adjust the volume.
8
Ear pad (right)
9
Ear pad (left)
SECTION 1
GENERAL
This section is extracted from
instruction manual.
LOCATING THE CONTROLS
3
MDR-IF8000
SECTION 2
DISASSEMBLY
2-1. HANGER (R)
2-2. VOL BOARD, RX1 BOARD, RX2 BOARD
Set
PD1 board
Hanger (R)
Hanger (L)
Driver ASSY (SP31) (R-CH SECTION)
Driver ASSY (SP11) (L-CH SECTION)
VOL board, RX1 board, RX2 board
PD2 board
Head band (R) ASSY, Head band (F) ASSY, SW board
7
Remove solder (four places)
5
Hanger (R)
3
Hanger lid (R) ASSY
4
Screw (+P 2X8)
Chassis
Lid (R), rear
6
Screw (+P 2X5)
2
Two screws (+P 2X5)
1
Screw (+P 2X8)
3
Remove solder (six places)
6
RX1 board
7
RX2 board
Lid (R), rear
1
CN502
2
VOL board
chassis
4
5
Note : Follow the disassembly procedure in the numerical order given.
· The equipment can be removed using the following procedure.
4
MDR-IF8000
2-4. DRIVER ASSY (SP31) (R-CH SECTION), DRIVER ASSY (SP11) (L-CH SECTION)
2-3. PD1 BOARD
· Can remove PD2 board with similar method.
3
Remove solder (two places)
2
Window, ray catcher
4
PD1 board
1
Screw (M1.7X5)
· Can remove driver ASSY (SP11) L-CH with similar method.
1
Pad, ear
8
Remove solder (two places)
1
Applied the bond in
outside lap with 2mm
width
2
Tow screws (M1.7X5)
5
Screw (+P2X5)
7
Three screws (+P2X5)
3
Claw
3
Claw
2
6
Claw
4
Ring (ear pad R)
Driver ASSY (SP31)
Plate, support
Driver ASSY
Cushion
Frame (R) ASSY
Bond: Sony bond SC608LV
(7-432-912-52)
Attach the cushion
5
MDR-IF8000
2-5. HANGER (L), HEADBAND (R) ASSY, HEAD BAND (F) ASSY, SW BOARD
Headband (F) ASSY
R-CH section
Headband (R) ASSY
Headband (R) ASSY
1
Screw (+P2X4)
0
Remove solder
(two places)
6
Lid (R), rear
7
Screw (+P2X4)
5
Two screws (+P2X5)
4
Screw (+P2X8)
2
9
3
8
qa
Screw (+P2X5)
qs
SW board
Hanger (L)
L-CH section