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HCD-BX9/DX9
SERVICE MANUAL
HCD-BX9/DX9 is the tuner, deck, CD and
amplifier section in MHC-BX9/DX9.
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
-- Continued on next page --
Model Name Using Similar Mechanism
HCD-BX7/DX7/DX7J
CD Mechanism Type
CDM58-K2BD38
Base Unit Type
BU-K2BD38
Optical Pick-up Type
KSM-213DAP/ZNP
Model Name Using Similar Mechanism
HCD-BX7/DX7/DX7J
Tape Transport Mechanism Type
TCM-230MWR11
CD
SECTION
TAPE DECK
SECTION
Photo: HCD-DX9
AEP Model
UK Model
HCD-BX9
E Model
Australian Model
HCD-DX9
Amplifier section
European model:
DIN power output (rated)
130 + 130 W
(6
at 1 kHz, DIN)
Continuous RMS power output (reference)
170 + 170 W
(6
at 1 kHz, 10% THD)
Other models:
The following measured at AC 120, 220, 240 V
50/60 Hz
DIN power output (rated)
220 + 220 W
(4
at 1 kHz, DIN)
Continuous RMS power output (reference)
300 + 300 W
(4
at 1 kHz, 10% THD)
Inputs
MD/VIDEO (AUDIO) IN:
(phone jacks)
voltage 450 mV/250 mV,
impedance 47 k
MIC:
(phone jack)
sensitivity 1 mV,
impedance 10 k
Outputs
PHONES:
(stereo mini jack)
accepts headphones of 8
or more
FRONT SPEAKER:
HCD-BX9:
accepts impedance of 6 to 16
HCD-DX9:
accepts impedance of 4 to 16
CD player section
System
Compact disc and digital audio system
Laser
Semiconductor laser (
=780 nm)
Emission duration: continuous
Laser output
Max. 44.6 µW*
*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz ­ 20 kHz (±0.5 dB)
Wavelength
780 ­ 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
­18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response (DOLBY NR OFF)
40 ­ 13,000 Hz (±3 dB),
using Sony TYPE I cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 ­ 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75
, unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
BX9, Saudi Arabia models:
531 ­ 1,602 kHz
(with the interval set at 9 kHz)
Other models:
531 ­ 1,602 kHz
(with the interval set at 9 kHz)
530 ­ 1,710 kHz
(with the interval set at 10 kHz)
Antenna
AM Loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz


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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of soldering iron around 270°C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
General
Power requirements
BX9 model:
230 V AC, 50/60 Hz
Australian model:
230 - 240 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 - 240 V AC,
50/60 Hz
Adjustable with voltage selector
Power consumption
HCD-BX9: 180 W
HCD-DX9: 300 W
Dimensions (w/h/d)
Approx. 280
× 360 × 425 mm
(11
× 14 3/16 × 16 11/16 in.)
Mas:
HCD-DX9: Approx. 11 kg (24 lbs. 5 oz)
HCD-BX9: Approx. 9.5 kg (21 lbs.)
Supplied accessories
AM loop antenna (1)
Remote commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to change
without notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.


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MODEL IDENTIFICATION
-- BACK PANEL --
TABLE OF CONTENTS
1. SERVICE NOTE ······························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBLY ································································ 7
4. TEST MODE ···································································· 12
5. MECHANICAL ADJUSTMENTS ····························· 16
6. ELECTRICAL ADJUSTMENTS ······························· 16
7. DIAGRAMS
7-1.
Circuit Board Location ····················································· 21
7-2.
Block Diagrams ································································ 22
7-3.
Printed Wiring Board ­ BD Section ­ ······························ 24
7-4.
Schematic Diagram ­ BD Section ­ ································· 25
7-5.
Printed Wiring Board ­ Main Section ­ ··························· 26
7-6.
Schematic Diagram ­ Main (1/3) Section ­ ····················· 27
7-7.
Schematic Diagram ­ Main (2/3) Section ­ ····················· 28
7-8.
Schematic Diagram ­ Main (3/3) Section ­ ····················· 29
7-9.
Printed Wiring Board ­ Power AMP Section ­
(BX9 model) ····································································· 30
7-10. Schematic Diagram ­ Power AMP Section ­
(BX9 model) ····································································· 31
7-11. Printed Wiring Board ­ Power AMP Section ­
(DX9 model) ····································································· 32
7-12. Schematic Diagram ­ Power AMP Section ­
(DX9 model) ····································································· 33
7-13. Printed Wiring Board ­ Panel Section ­ ··························· 34
7-14. Schematic Diagram ­ Panel Section ­ ····························· 35
7-15. Printed Wiring Board ­ Leaf SW Section ­ ···················· 36
7-16. Schematic Diagram ­ Leaf SW Section ­ ························ 37
7-17. Printed Wiring Board ­ Driver Section ­ ························· 38
7-18. Schematic Diagram ­ Driver Section ­ ···························· 39
7-19. Printed Wiring Board ­ Trans Section ­
(BX9 model) ····································································· 40
7-20. Schematic Diagram ­ Trans Section ­
(BX9 model) ····································································· 41
7-21. Printed Wiring Board ­ Trans Section ­
(DX9 model) ····································································· 42
7-22. Schematic Diagram ­ Trans Section ­
(DX9 model) ····································································· 43
7-23. IC Pin Function Description ············································· 44
7-24. IC Block Diagrams ··························································· 46
8. EXPLODED VIEWS
8-1.
Main Section ····································································· 49
8-2.
Panel Section ···································································· 50
8-3.
Main Board Section ·························································· 51
8-4.
Tape Mechanism Deck Section ········································ 52
8-5.
CD Mechanism Deck Section (CDM58-K2BD38) ·········· 53
8-6.
Base Unit Section (BU-K2BD38) ···································· 54
9. ELECTRICAL PARTS LIST ······································· 55
PARTS No.
· Abbreviation
AUS
: Australian model
EA
: Saudi Arabia model
MY
: Malaysia model
SP
: Singapore model
MX
: Mexican model
AR
: Argentina model
MODEL
BX9, DX9: MX models
DX9: E, AR, SP, MY, EA, AUS models
PARTS No.
4-225-041-4s
4-225-041-5s


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SECTION 1
SERVICE NOTE
Screw hole
Attach the panel board with
six screws (+BVTP 2.6
× 8 )
after the board is removed once.
Do not tighten the screws excessively.
1
Cut the eleven melted-connection points with a cutting plier.
Note for installing the panel board
2
Panel board
Hot melt


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SECTION 2
GENERAL
1
DISC SKIP EX-CHANGE button
2
DISC 1 button and indicator
3
DISC 2 button and indicator
4
DISC 3 button and indicator
5
Z OPEN/CLOSE button
6
EDIT, TUNER MOMERY button
7
PLAY MODE, STEREO/MONO button
8
REPEAT, DOLBY NR button
9
DIRECTION knob (DX9 model)
DIRECTION, PTY knob (BX9 model)
q;
SURROUND button
qa
VOLUME knob
qs
PHONES jack
qd
ENTER button
qf
REC PAUSE/START button and indicator
qg
CD SYNC HI-DUB button
qh
LOOP button (BX9 model)
KARAOKE PON button (DX9 model)
qj
MIC jack (DX9 model)
qk
MIC LEVEL knob (DX9 model)
ql
V-GROOVE button and indicator
w;
CURSOL button and indicator
wa
GROOVE button
ws
EQ EDIT button
wd
SPECTRUM button
wf
DISPLAY button
wg
?/1 button and indicator
wh
TUNER/BAND button
wj
MD (VIDEO) button
wk
Y button
wl
> + button
e;
X button
ea
­ . button
es
x button
ed
TAPE A/B button
ef
CD button
eg
Function indicator
eh
m/M knob
Photo: HCD-BX9
12 3 4
5
6
7
8
qa
qs
qd
qf
qg
qh
w;
ws
ed
ef
wh
wj
eh
wk
wl
e;
ea
9
q;
wa
ql
wd
wf
wg
es
qk
qj
eg