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COMPACT DISC CHANGER
US Model
Canadian Model
CDX-705/EXCD-3
AEP Model
UK Model
E Model
CDX-705
SERVICE MANUAL
CDX-705/EXCD-3
Photo: CDX-705
Model Name Using Similar Mechanism
NEW
CD Drive Mechanism Type
MG-250A-137
Optical Pick-up Name
KSS-521A/J2RP
SPECIFICATIONS
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: 780 nm
Emission Duration: Continuous
Laser out-put Power: Less than 44.6 µW*
* This output is the value measured at a distance of 200
mm from the objective lens surface on the Optical Pick-
up Block.
Frequency response 10-20,000 Hz
Wow and flutter
Below the measurable limit
Signal-to-noise ratio 94 dB
Outputs
BUS control output (8 PIN)
Analog audio output (RCA PIN)
Current drain
800 mA (during CD playback)
800 mA (during loading or ejecting a disc)
Operating temperature
­10 ºC to +55 ºC
Dimensions
Approx. 262
× 90 × 181.5 mm
(10 3/8
× 3 5/
8
× 7 1/
4
in.) (w/h/d)
not incl. projecting parts and controls
Mass
Approx. 2.1 kg (4 lb. 10 oz.)
Power requirement
12 VDC car battery
(negative ground)
Supplied accessories Disc magazine (1)
Parts for installation and connections (1 set)
Design and specifications subject to change without notice.
Ver 1.1 2001.08
9-925-527-12
Sony Corporation
2001H0500-1
e Vehicle Company
C
2001.8
Shinagawa Tec Service Manual Production Group


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­ 2 ­
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
TABLE OF CONTENTS
1.
GENERAL
Installation .........................................................................
5
Connections .......................................................................
6
2.
DISASSEMBLY ............................................................ 8
3.
ELECTRICAL ADJUSTMENTS ........................... 14
4.
DIAGRAMS
4-1. Block Diagram ................................................................... 15
4-2. Printed Wiring Board ­ RF Section ­ ................................ 17
4-3. Schematic Diagram ­ RF Section ­ ................................... 19
4-4. Schematic Diagram ­ MAIN Section ­ ............................. 23
4-5. Printed Wiring Board ­ MAIN Section ­ .......................... 27
4-6. IC Pin Function Description .............................................. 33
5.
EXPLODED VIEWS ................................................... 35
6.
ELECTRICAL PARTS LIST .................................... 40
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Laser Diode Properites
· Material: GaAlAs
· Wavelength: 780 nm
· Emission Duration: continuous
· Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C during
repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED
LINE WITH MARK
! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
SERVICING NOTES


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DISC MAGAZINE GETTING OUT PROCEDURE ON THE
POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) assy to arrow direction.
2) Removal the magazine assy.
Note: Take out the magazine only when the tray is completely within
the magazine. If the disk or tray is sticking out, turn on the
power and eject the magazine.
Lever (stop) ass'y
Magazine ass'y


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SECTION 1
GENERAL
This section is extracted from
CDX-705's instruction manual.
­ 5 ­
­ 6 ­


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­ 7 ­
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Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER), FRONT PANEL ASS'Y
SECTION 2
DISASSEMBLY
MECHANISM DECK
1 screw
(PTT2.6
× 6)
3 lever (FL)
1 screw
(PTT2.6
× 6)
1 screw
(PTT2.6
× 6)
2 case (upper)
1 screw
(PTT2.6
× 6)
3 lever (FL)
1 screw
(PTT2.6
× 6)
4 front panel ass'y
1 two dampers (250)
2 spring (FL)
4 mechanism deck
2 spring (FL)
1 two dampers (250)
3 jack flexible board
(CN901)