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SERVICE MANUAL
PORTABLE CD PLAYER
US Model
D-NE329LIV/NE329SP
Canadian Model
D-NE329SP
AEP Model
E Model
Tourist Model
D-NE320SP
SPECIFICATIONS
D-NE320SP/NE329LIV/
NE329SP
Photo: D-NE320SP
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM-3325ERV
Optical Pick-up Name
DAX-25EV
9-879-439-05
2005J05-1
© 2005.10
Sony Corporation
Personal Audio Division
Published by Sony Engineering Corporation
­ Continued on next page ­
US and foreign patents licensed from Dolby Laboratories.
· SonicStage and SonicStage logo are trademarks or registered trademarks of Sony Corporation.
· OpenMG, Net MD, ATRAC, ATRAC3plus and their logos are trademarks of Sony Corporation.
· "WALKMAN" is a registered trademark of Sony Corporation to represent Headphone Stereo
products.
is a trademark of Sony Corporation.
· Microsoft, Windows, Windows NT and Windows Media are trademarks or registered
of Microsoft Corporation in the United States and /or other countries.
trademarks
· IBM and PC/AT are registered trademarks of International Business Machines Corporation.
· Macintosh is a trademark of Apple Computer, Inc. in the United States and/or other countries.
· Pentium is a trademark or a registered trademark of Intel Corporation.
· All other trademarks and registered trademarks are trademarks or registered trademarks
respective holders. TM and ® marks are omitted in this manual.
of their
· CD and music-related data from Gracenote, Inc., copyright © 2000-2003 Gracenote.
Gracenote CDDB® Client software, copyright 2000-2003 Gracenote. This product and
may practice one or more of the following U.S. Patents: #5,987,525; #6,061,680;
service
#6,161,132, #6,230,192, #6,230,207, #6,240,459, #6,330,593, and other
#6,154,773,
patents issued or pending.
Gracenote and CDDB are registered trademarks of Gracenote. The Gracenote logo and
the Gracenote CDDB logo, and the "Powered by Gracenote" logo are
logotype,
trademarks of Gracenote.
Program © 2001, 2002, 2003, 2004 Sony Corporation
Documentation © 2004 Sony Corporation
US, CND, MX models)
Ver. 1.4 2005.10
100 - 240 V, 50/60 Hz (Other models)
Output (at 3 V input level)
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW at 16
(Approx. 1.5 mW + Approx. 1.5 mW at 16
)*
*For the customers in AEP and EE models


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2
D-NE320SP/NE329LIV/NE329SP
TABLE OF CONTENTS
1.
SERVICING NOTES ............................................... 3
2.
GENERAL ................................................................... 5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Cabinet (Lower), Upper Lid Sub Assy ............................
6
3-3.
JACK Board, Optical Pick-up Assy (CDM-3325ERV) ...
7
3-4.
SWITCH Board ...............................................................
7
4.
DIAGRAMS ................................................................. 8
4-1.
Printed Wiring Board ­ EGL Board ­ ............................. 10
4-2.
Schematic Diagram ­ EGL Board ­ ................................ 11
4-3.
Printed Wiring Board
­ JACK Board (Component Side) ­ ................................ 12
4-4.
Printed Wiring Boards
­ JACK Board (Conductor Side)/SUB Board ­ .............. 13
4-5.
Schematic Diagram ­ JACK/SUB Boards ­ ................... 14
4-6.
Printed Wiring Board
­ SWITCH Board ­ ......................................................... 15
4-7.
Schematic Diagram
­ SWITCH Board ­ ......................................................... 15
5.
EXPLODED VIEWS
5-1.
Upper Lid Section ........................................................... 22
5-2.
Cabinet (Lower) Section .................................................. 23
5-3.
Optical Pick-up Section (CDM-3325ERV) ..................... 24
6.
ELECTRICAL PARTS LIST ................................ 25
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES
SONT
CRITIQUES
POUR
LA
SÉCURITÉ
DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Supplied Accessories
, JE
s
8, JE
s
n
Ver. 1.2
· Abbreviation
CND : Chinese model
E18 : Asian area in E model
E33 : Panama, Venezuelan and Caribbian Can model
EE
: East European and Russian model
JE
: Tourist model
MX : Mexican and Colombian model


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3
D-NE320SP/NE329LIV/NE329SP
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
· Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
OPERATION CHECK WHEN THE LID IS OPEN
In performing the repair with the power supplied to the set, removing
the JACK board causes the set to be disabled.
In such a case, make a solder bridge to short SL501 (OPEN) on the
JACK board in advance.
­ JACK Board (Component Side) ­
SL501
(OPEN)
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S502. (push switch type)
The following checking method for the laser diode is operable.
· Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S502 with a screwdriver having
a thin tip as shown in Fig. 1.
3. Push the u ENTER button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power
control circuit or optical pick-up is faulty.
In this operation, the objective lens will move up and down 2
times along with inward motion for the focus search.
NOTES ON REPLACEMENT OF EGL BOARD OR
EEPROM (IC1602)
When EGL board is replaced or EEPROM (IC1602) on the EGL
board is replaced, patch processing is needed.
Confirm about information of patch processing to each service
headquarters.
Fig. 1 Method to push the S502
S502
lever (detection)
lever (detection)
JACK board
Ver. 1.4


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4
D-NE320SP/NE329LIV/NE329SP
Providing the required system environment
The following system environment is required in order to use the SonicStage Ver. 2.3.
This software is not supported by the following environments:
· OSs other than the indicated above
· Personally constructed PCs or operating systems
· An environment that is an upgrade of the original manufacturer-installed operating system
· Multi-boot environment
· Multi-monitor environment
· Macintosh
· We do not ensure trouble-free operation on all computers that satisfy the system requirements.
· The NTFS format of Windows XP/Windows 2000 Professional can be used only with the standard
(factory) settings.
· We do not ensure trouble-free operation of the system suspend, sleep, or hibernation function on all
computers.
· For Windows 2000 Professional users, install Service Pack 3 or later before using the software.
System requirements
Computer
IBM PC/AT or Compatible
·CPU: Pentium II 400 MHz or higher (Pentium III 450 MHz or higher
is recommended.)
·Hard disk drive space: 200 MB or more (1.5 GB or more is
recommended) (The amount space will vary according to Windows
version and the number of music files stored on the hard disk.)
·RAM: 64 MB or more (128 MB or more is recommended)
Others
·CD drive (capable of digital playback by WDM)
·Sound Board
·USB port (supports USB (previously USB 1.1))
Operating
System
Factory installed:
Windows XP Media Center Edition 2005/Windows XP Media Center
Edition 2004/Windows XP Media Center Edition/Windows XP
Professional/Windows XP Home Edition/Windows 2000 Professional/
Windows Millennium Edition/Windows 98 Second Edition
Display
High Color (16 bit) or higher, 800
600 dots or better (1024
768 dots
or better is recommended)
Others
·Internet access: for Web registration, EMD services and CDDB
·Windows Media Player (version 7.0 or higher) installed for playing
WMA files
Notes


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5
D-NE320SP/NE329LIV/NE329SP
SECTION 2
GENERAL
This section is extracted from
instruction manual.
CD player
Remote (E18, JE models only*)
¥ Abbreviation
E18: Asian area in E model
Speaker stand
JE : Tourist model
Ver. 1.1