MICROFILM
SERVICE MANUAL
COMPACT DISC CHANGER
US Model
Canadian Model
AEP Model
UK Model
E Model
Model Name Using Similar Mechanism
NEW
CD Drive Mechanism Type
MG-250B-137
Optical Pick-up Name
KSS-521A/J2N
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: 780 nm
Emission Duration: Continuous
Laser out-put Power: Less than 44.6 µW*
* This output is the value measured at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block.
Frequency response
10 20,000 Hz
Wow and flutter
Below the measurable limit
Signal-to-noise ratio
94 dB
Outputs
BUS control output (8 pins)
Analog audio output (RCA pin)
Currnet drain
800 mA (during CD playback)
800 mA (during loading or ejecting a disc)
Operating temperature
10°C to +55°C (14°F to 131°F)
Dimensions
Approx. 262
× 90 × 181.5 mm
(10 3/8
× 3 5/8 × 7 1/4 in.)
(w/h/d)
not incl. projecting parts and controls
Mass
Approx. 2.1 kg (4 lb. 10 oz.)
Power requirement
12 V DC car battery (negative ground)
Supplied accessories
Disc magazine (1)
Parts for installation and connections (1 set)
Design and specifications subject to change without notice.
SPECIFICATIONS
CDX-715
2
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properites
· Material: GaAlAs
· Wavelength: 780 nm
· Emission Duration: continuous
· Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1.
SERVICE NOTE ........................................................ 2
2.
GENERAL
Installation ....................................................................... 5
Connections ..................................................................... 6
3.
DISASSEMBLY ......................................................... 8
4.
MECHANISMDECK ASSEMBLY ...................... 14
5.
MECHANICAL ADJUSTMENTS ....................... 18
6.
ELECTRICAL ADJUSTMENTS ......................... 19
7.
DIAGRAMS
7-1. Block Diagram
SERVO Section ......................................................... 21
MAIN Section ........................................................... 23
7-2. Printed Wiring Boards RF Section .......................... 25
7-3. Schematic Diagram RF Section ................................ 27
7-4. Printed Wiring Board
MAIN Section MAIN Board (Component side) ...... 29
MAIN Section MAIN Board (Conductor side) ........ 31
7-5. Schematic Diagram
MAIN Section MAIN Board (1/2) ........................... 33
MAIN Section MAIN Board (2/2) ........................... 35
7-6. Printed Wiring Board JACK Section ....................... 37
7-7. Schematic Diagram JACK Section ........................... 38
7-8. IC Pin Function Description ........................................... 45
8.
EXPLODED VIEWS ................................................ 47
9.
ELECTRICAL PARTS LIST ............................... 52
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED
LINE WITH MARK
! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
SECTION 1
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
3
4
DISC MAGAZINE GETTING OUT PROCEDURE ON
THE POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) ass'y to arrow direction.
2) Removal the magazine ass'y.
Note: Take out the magazine only when the tray is completely within the
magazine. If the disc or tray is sticking out, turn on the power and
eject the magazine.
Lever (stop) ass'y
Magazine ass'y
5
6
SECTION 2
GENERAL
This section is extracted from
instruction manual.
7