MICROFILM
SERVICE MANUAL
US Model
Canadian Model
Model Name Using Similar Mechanism
XR-C5100
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-4890
Photo: XR-4890
FM/AM CASSETTE CAR STEREO
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TABLE OF CONTENTS
1.
GENERAL
Location of Controls ....................................................... 3
Resetting the Unit ........................................................... 4
Detaching the Front Panel ............................................... 4
Setting the Clock ............................................................. 4
Installation ....................................................................... 5
Connections ..................................................................... 6
2.
DISASSEMBLY ......................................................... 9
3.
ASSEMBLY OF MECHANISM DECK ............ 11
4.
MECHANICAL ADJUSTMENTS ....................... 14
5.
ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 14
6.
DIAGRAMS ................................................................. 15
6-1. Printed Wiring Board MAIN Section ........................ 17
6-2. Schematic Diagram MAIN (1/2) Section .................. 19
6-3. Schematic Diagram MAIN (2/2) Section .................. 21
6-4. Printed Wiring Board PANEL Section ...................... 23
6-5. Schematic Diagram PANEL Section ......................... 25
6-6. IC Pin Function Description ........................................... 27
7.
EXPLODED VIEWS ................................................ 29
8.
ELECTRICAL PARTS LIST ............................... 32
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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SECTION 1
GENERAL
This section is extracted from
instruction manual.
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