MICROFILM
SERVICE MANUAL
FM/AM CASSETTE CAR STEREO
US Model
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
MG-25D-136
SPECIFICATIONS
XR-C8200
Dolby noise reduction manufactured under license
form Dolby Laboratories Licensing Corporation.
"DOLBY" and the double-D symbol
a are trade-
marks of Dolby Laboratories Licensing Corporation.
For RM-X2S (Remote Commander),
please refer to RM-X2S/X3S Service
Manual (9-960-039-
) previously issued.
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TABLE OF CONTENTS
1.
GENERAL
Location of Controls ....................................................... 3
Resetting the Unit ........................................................... 4
Detaching the Font Panel ................................................ 4
Preparing the Rotary Commander .................................. 4
Setting the Clock ............................................................. 4
Installation ....................................................................... 5
Connections ..................................................................... 6
2.
DISASSEMBLY ......................................................... 8
3.
ASSEMBLY OF MECHANISM DECK ........... 11
4.
MECHANICAL ADJUSTMENTS ....................... 14
5.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 14
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
6.
DIAGRAMS
6-1. IC Pin Function Description ........................................... 18
6-2. Printed Wiring Board MAIN Section ...................... 25
6-3. Schematic Diagram MAIN Section .......................... 29
6-4. Printed Wiring Boards PANEL Section .................. 33
6-5. Schematic Diagram PANEL Section ....................... 35
7.
EXPLODED VIEWS ................................................ 41
8.
ELECTRICAL PARTS LIST ............................... 44
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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SECTION 1
GENERAL
This section is extracted from
instruction manual.
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