MICROFILM
SERVICE MANUAL
US Model
XR3F-19B160
COMPACT DISC PLAYER
Model Name Using Similar Mechanism
F8ZF-19B160
CD Drive Mechanism Type
MG-205F-132
Optical Pick-Up Name
KSS-313B/Z-N
System
Compact disc digital audio system
Disc
Compact disc
Laser
Semiconductor laser (
=780 nm)
Spindle speed
200 r.p.m. to 500 r.p.m. (CLV)
Error correction
Sony Super Strategy Cross Interleave Read
Solomon Code
Number of channels
2
D-A conversion
1-bit
Frequency response
20 to 20,000 Hz
dB
Harmonic distortion
0.02% (1 kHz)
Dynamic range
85 dB
Signal to noise ratio
85 dB
Channel separation
70 dB
Wow and flutter
Below measurable limit
Outputs
Ford Signal Connector
Disc
Track pitch
1.6 µm
Sampling frequency
44.1 kHz
Quantization
16 bit linear quantizing/channel
Modulation system
EFM
Transfer rate
2.03 Mbit/sec. (before modulation)
General
Power requirements
14.4 V dc car battery (negative ground)
Current drain
1 A (playback)
2 A (during disc loading or eject)
Operating temperature
20°C to +60°C (4°F to +120°F)
Dimensions
Approx. 188
× 59 × 160.6 mm (w/h/d)
(7-1/2
× 2-7/20 × 6-2/5 in.)
including projecting parts and controls
Weight
Approx. 1.3 kg (3 lb), net
SPECIFICATIONS
The electrical adjustments are done
automatically in this set.
Version: AA
+1.0
1.5
2
TABLE OF CONTENTS
1.
DISASSEMBLY ....................................................... 3
2.
DIAGRAMS
21. Block Diagram SERVO Section ................................. 6
22. Block Diagram MAIN Section ................................... 7
23. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 8
24. Printed Wiring Boards SERVO Section ..................... 9
25. Schematic Diagram SERVO Section (1/2) ................. 10
26. Schematic Diagram SERVO Section (2/2) ................. 11
27. Printed Wiring Boards MAIN Section ....................... 12
28. Schematic Diagram MAIN Section ............................ 13
29. Printed Wiring Board KEY Board .............................. 14
210. Schematic Diagram KEY Board ................................. 14
211. IC Pin Function Description ........................................... 15
3.
EXPLODED VIEWS ............................................... 17
4.
ELECTRICAL PARTS LIST ................................ 21
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properties
· Material: GaAlAs
· Wavelength: 780 nm
· Emission Duration: continuous
· Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED
LINE WITH MARK
! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK OR BASE UNIT
3
CASE
FRONT PANEL
Note: Follow the disassembly procedure in the numerical order given.
SECTION 1
DISASSEMBLY
1 screw (PTT2.6
× 5)
1 screw (K2.6
× 6)
case
4
4
5
3
3
6 flat cable (CN104)
1 screw (K2.6
× 6)
2 screw (K2.6
× 6)
2 screw (K2.6
× 6)
3 reinforcement
3 reinforcement
front panel
4 two claws
5
4
· IC Block Diagrams
IC301
PCM1710U-A/1K (MD MAIN BOARD)
IC402
BA6394F (MD MAIN BOARD)
IC302
SM5852CS-E2 (MD MAIN BOARD)
IC401
BA6287F (MD MAIN BOARD)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
27
26
25
24
23
22
21
20
19
18
17
16
15
28
INPUT
INTERFACE
DIGITAL
FILTER
NOISE
SHAPER
5-LEVEL DAC
RIGHT
LOW-PASS FILTER
RIGHT
3-STAGE AMP
RIGHT
LOW-PASS FILTER
LEFT
3-STAGE AMP
LEFT
5-LEVEL DAC
LEFT
MODE
CONTROL
TIMING
CONTROL
LRCIN
DIN
BCKIN
CLKO
XTI
XTO
DGND
VDD
VCC2R
GND2R
EXT1R
EXT2R
VOUTR
GND1
ML/DSD
MC/DM2
MD/DM1
MUTE
MODE
CKSL
DGND
VDD
VCC2L
VCC1
GND2L
EXT1L
EXT2L
VOUTL
1
2
3
4
5
6
7
8
9
10
16
15
14
13
12
11
DIGITAL
SIGNAL
PROCESSOR
OUTPUT
INTERFACE
SYSTEM
CLOCK
INPUT
INTERFACE
SEQUENTIAL
CONTROL
MUTE
CONTROL
MODE
CONTROL
LRCI
BCKI
DI
CLK
VSS
RSTN
TESTN
MUTEN
DB/DS
MOD2
MOD1
OPT
VDD
LRCO
BCKO
DOUT
1
2
3
4
OUT1
VM
VCC
FIN
8
7
6
5
GND
OUT2
VREF
RIN
CONTROL LOGIC
TSD
POWER
SAVE
DRIVER
DRIVER
GND
+
+
+
+
DRIVER
CH3
GND
VCC
DRIVER
CH4
+
+
+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
+
+
DRIVER
CH2
GND
VCC
OP-AMP
DRIVER
CH1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DRIVER
MUTE
THERMAL
SHUTDOWN
BIAS
SECTION 2
DIAGRAMS
5
5
IC501
CXA1782BR (MD MAIN BOARD)
IC502
CXD2507AQ (MD MAIN BOARD)
IC401
TL5001CD (MAIN BOARD)
IC101
BA3129F-T1 (MAIN BOARD)
IC502
SN74HC165ANS (KEY BOARD)
36
35
34
33
32
31
30
29
28
27 26 25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
37
38
39
40
41
42
43
44
45
46
47
48
PHD
2
PHD
1
PHD
LD
RF
O
RF
I
CP
CB
CC1
CC2
FOK
SENS
C.OUT
XRST
DATA
XLT
CLK
VCC
ISET
SL O
SL M
SL P
TA O
TA
M
FSET
TG2
TGU
SRCH
FE
O
FLB
FGD
FDFCT
FE
M
FEI
FEO
FE BIAS
F
E
EI
VEE
TED
LPFI
TEI
ATSC
TZC
TDFCT
VC
APC
LEVEL S
FOK
MIRR
RF IV AMP1
RF IV AMP2
FE
AMP
TTL
IIL
FZC COMP
DFCT
IIL
TTL
IIL DATA REGISTER
INPUT SHIFT REGISTER
ADDRESS DECODER
OUTPUT DECODER
TTL
IIL
TOG1-3
BAL1-3
FS1-4
TG1-2
TM1-7
PS1-4
F IV AMP
E IV AMP
BAL1
BAL2
BAL
3
TE AMP
TZC COMP
DFCT
TM1
DFCT
FS4
ATSC
WINDOW COMP
TOG1
TOG2
TOG3
FCS PHASE
COMPENSATION
FS1
FSET
TG2
TM7
TM3
TM4
TM5
TM6
ISET
TRACKING
PHASE
COMPENSATION
HPF COMP
LPF COMP
TG1
FS2
TM2
RF
M
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
52
53
54
55
56
57
58
59
60
61
62
63
64
19
FOK
MON
MDP
MDS
LOCK
TEST
FILO
FILI
PCO
VSS
AVSS
CLTV
AVDD
RF
BIAS
ASYI
ASYO
ASYE
WDCK
DATA
XRST
SENS
MUTE
SQCK
SQSO
EXCK
SBSO
SCOR
VSS
WFCK
EMPH
DOUT
C4M
FSTT
XTSL
XTAO
XTAI
MNTO
SERVO AUTO
SEQUENCER
CPU
INTERFACE
DIGITAL
CLV
SUB CODE
PROCESSOR
EFM
DEMODULATOR
DIGITAL
PLL
ASYMMETRY
CORRECTOR
D/A
INTERFACE
ERROR
CORRECTOR
16K
RAM
DIGITAL
OUT
CLOCK
GENERATOR
LRCK
PCMD
BCLK
GTOP
XUGF
XPCK
V
DD
GFS
RFCK
CZPO
XROF
MNT3
MNT1
XLON
SPOD
SPOC
SPOB
SPOA
CLKO
V
DD
XLTO
DATO
CNIN
SEIN
CLOK
XLAT
3
5
14
4
5
3
6
8
+
+
+
+
1
2
3
4
5
9
10
14
13
12
11
6
7
+IN2A
IN2A
+IN2B
IN2B
OUT2
SW2
VCC
VEE
SW1
OUT1
IN1B
+IN1B
IN1A
+IN1A
REFERENCE
VOLTAGE
S.C.P.
COMPARATOR 1
SWITCH
'ON'
AT
'H'
PWM
COMPARATOR
S.C.P.
COMPARATOR 2
DEAD-TIME
COMPARATOR
S.C.P.
LATCH
OSC
U.V.L.O
ERROR
AMP
+
+
+
+
+
5
6
7
8
1
2
3
4
OUT
VCC
FEED
BACK
INPUT
SCP
DEAD-TIME
CONTROL
RT
GND
1
2
3
4
5
6
7
8
9
10
16
15
14
13
12
11
CK
EF
G
H
QH
D
C
B
A
SERIAL
IN
CLOCK
INHIBIT
SHIFT/
LOAD
GND
QH
VCC
OUTPUT
QH
SERIAL
INPUT
A
B
C
D
CLOCK
INHIBIT
SHIFT/
LOAD
CLOCK
E
F
G
H
OUTPUT
QH
PARALLEL INPUTS
PARALLEL INPUTS