MICROFILM
SERVICE MANUAL
FM/MW/SW CASSETTE CAR STEREO
Saudi Arabia Model
Model Name Using Similar Mechanism
XR-4800
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-3750
MC-Service
2
TABLE OF CONTENTS
1.
GENERAL
Location of Controls .......................................................
3
Resetting the Unit ...........................................................
4
Detaching the Front Panel ...............................................
4
Setting the Clock .............................................................
4
Dismounting the Unit ......................................................
4
Installation .......................................................................
5
Connection ......................................................................
6
2.
DISASSEMBLY ......................................................... 8
3.
ASSEMBLY OF MECHANISM DECK ........... 10
4.
MECHANICAL ADJUSTMENTS ....................... 13
5.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 13
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 14
6.
DIAGRAMS
6-1. IC Pin Function Description ........................................... 17
6-2. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 20
6-3. Printed Wiring Board MAIN Section ...................... 21
6-4. Schematic Diagram MAIN Section (1/2) ................. 23
6-5. Schematic Diagram MAIN Section (2/2) ................. 25
6-6. Printed Wiring Board PANEL Section .................... 27
6-7. Schematic Diagram PANEL Section ....................... 29
7.
EXPLODED VIEWS ................................................ 33
8.
ELECTRICAL PARTS LIST ............................... 36
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
3
SECTION 1
GENERAL
This section is extracted from
instruction manual.
4
MC-Service
5