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SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
XM-502Z
STEREO POWER AMPLIFIER
AUDIO POWER SPECIFICATIONS (US model)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
50 watts per channel minimum continuous average power into 4 ohms,
both channels driven from 20 Hz to 20 kHz with no more than 0.04% total
harmonic distortion per Car Audio Ad Hoc Committee standards.
Other Specifications
Circuit system
OTL (output transformerless) circuit
Pulse power supply
Inputs
RCA pin jacks
High level input connector
Input level adjustment range
0.3 6 V (RCA pin jacks),
0.6 12 V (High level input)
Outputs
Speaker terminals
Speaker impedance
2 8
(stereo)
4 8
(when used as a bridging amplifier)
Maximum outputs
100 W
× 2 (at 4 )
250 W (BTL, at 4
)
Rated outputs (supply voltage at 14.4 V)
50 W
× 2 (20 Hz 20 kHz, 0.04% THD, at 4 )
60 W
× 2 (20 Hz 20 kHz, 0.1% THD, at 2 )
120 W (Monaural) (20 Hz 20 kHz, 0.1% THD,
at 4
)
Frequency response
5 Hz 80 kHz (
dB)
Harmonic distortion
0.005% or less (at 1 kHz, 4
, 10 W)
Low-pass filter
80 Hz, 18 dB/oct
Power requirements
12 V DC car battery
(negative ground)
Power supply voltage
10.5 16 V
Current drain
at rated output : 15 A (4
, 50 W × 2)
Remote input : 1 mA
Dimensions
Approx. 262
× 53.5 × 173 mm
(10 3/8
× 2 1/8 × 6 7/8 in.) (w/h/d) not incl.
projecting parts and controls
Mass
Approx. 1.9 kg (4 lb. 4 oz.) not incl. accessories
Supplied accessories
Mounting screws (4)
High level input cord (1)
Protection cap (1)
Design and specifications are subject to change without
notice.
SPECIFICATIONS
+0
3
Ver 1.0 2004. 01
9-877-517-01
2004A04-1
© 2004. 01
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
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TABLE OF CONTENTS
1. GENERAL
Connections ............................................................................. 3
2. DISASSEMBLY
2-1. Bottom Plate ........................................................................ 5
2-2. Main Board Section ............................................................ 6
2-3. Main Board ......................................................................... 6
3. DIAGRAMS
3-1. Printed Wiring Board .......................................................... 7
3-2. Schematic Diagram ............................................................. 8
3-3. IC Block Diagram ............................................................... 9
4. EXPLODED VIEWS
4-1. Heat Sink (Main) Section .................................................. 10
4-2. Main Board Section .......................................................... 11
5. ELECTRICAL PARTS LIST ........................................ 12
Notes on Chip Component Replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
XM-502Z
PROTECTOR OPERATION CHECK
Thermal Protect
1. Short across TH901 with the power on.
2. Verify that the protector is operated and LED901 illuminates
red.
3. Verify that the protector is released and LED901 illuminates green
when the short is removed.
4. Likewise, perform items 1 to 3 for TH902 and TH903.
Over Current Protect
1. Short between the positive and negative sides of the speaker
output terminal CN903 (2/2) with the power on.
(Perform this shorting for each channel on L and R.)
2. Verify that the protector is operated and LED901 illuminates
red.
3. Verify that the protector is not released and LED901 remains
red even when the short is removed.
4. Verify that the protector is released and LED901 illuminates green
when the power is turned off and then on again.
Offset Protect
1. Short between the +12V terminal of CN903 (1/2) and the BTL+
or BTL of the speaker output terminal CN903 (2/2).
(Short between +12V terminal and BTL+ and between +12V
terminal and BTL.)
2. Verify that the protector is operated and LED901 illuminates
red.
3. Verify that the protector is not released and LED901 remains
red even when the short is removed.
4. Verify that the protector is released and LED901 illuminates green
when the power is turned off and then on again.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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XM-502Z
SECTION 1
GENERAL
This section is extracted
from instruction manual.
4
XM-502Z
5
XM-502Z
SECTION 2
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
2-1.
BOTTOM PLATE
(Page 5)
2-2.
MAIN BOARD SECTION
(Page 6)
SET
2-3.
MAIN BOARD
(Page 6)
3
bottom plate
1
three screws
(+BTP 3
x 8)
2
three screws
(+BTP 3
x 8)