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SERVICE MANUAL
US Model
XM-1502SX/1902GX
Canadian Model
AEP Model
UK Model
E Model
XM-1502SX
XM-1502SX/1902GX
STEREO POWER AMPLIFIER
Other Specifications
Circuit system
OTL (output transformerless) circuit
Pulse power supply
Inputs
RCA pin jacks
High level input connector
Outputs
Speaker terminals
Through out pin jacks
Speaker impedance
2 ­ 8
(stereo) (XM-1502SX)
1.3 ­ 8
(stereo) (XM-1902GX)
4 ­ 8
(when used as a bridging amplifier)
Maximum outputs
300 W
× 2 (at 4 )
760 W (monaural) at 4
Rated outputs (supply voltage at 14.4 V)
150 W
× 2 (20 Hz ­ 20 kHz, 0.04% THD,
at 4
)
190 W
× 2 (20 Hz ­ 20 kHz, 0.1% THD,
at 2
)
190 W
× 2 (20 Hz ­ 20 kHz, 0.1% THD,
at 1.3
) (XM-1902GX)
380 W
× 1 (20 Hz ­ 20 kHz, 0.1% THD,
at 4
) (XM-1902GX)
380 W (monaural) (20 Hz ­ 20 kHz, 0.1% THD,
at 4
) (XM-1502SX)
Frequency response
5 Hz ­ 100 kHz (
dB)
Harmonic distortion
0.005% or less (at 1 kHz, 4
)
Input level adjustment range
0.2 ­ 6.0 V (RCA pin jacks)
0.4 ­ 12.0 V (High level input)
High-pass filter
50 ­ 300 Hz, ­12 dB/oct
Low-pass filter
50 ­ 300 Hz, ­12 dB/oct
Low boost
0 ­ 10 dB (40 Hz)
Phase shift adjustment range (XM-1902GX)
0° ­ 180° (at 40 Hz)
Power supply voltage
10.5 ­ 16 V
Current drain
at rated output : 40 A (at 4
)
Remote input : 2 mA
Dimensions
Approx. 358
× 50 × 264 mm
(14 1/8
× 2 1/4 × 10 1/2 in.)
(w/h/d) not incl. projecting parts and controls
Mass
Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories
Supplied accessories
Mounting screws (4)
Design and specifications are subject to change without
notice.
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
150 watts per channel minimum continuous average power into
4 ohms, both channels driven from 20 Hz to 20 kHz with no more
than 0.04% total harmonic distortion per Car Audio Ad Hoc
Committee standards.
+0.5
­3
Photo: XM-1902GX
Ver 1.3 2002. 07
9-870-239-14
2002G0400-1
© 2002. 07
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation


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TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls .......................................... 3
Connections ............................................................................. 3
2. DISASSEMBLY
2-1. Plate, Bottom ....................................................................... 6
2-2. Main Board ......................................................................... 6
2-3. Front Panel .......................................................................... 7
2-4. Led Board ............................................................................ 7
3. ELECTRICAL ADJUSTMENT ...................................... 8
4. DIAGRAMS
4-1. Block Diagram .................................................................... 9
4-2. Printed Wiring Boards ­Main Section­ ............................ 11
4-3. Schematic Diagram ­Main Section (1/2)­ ........................ 12
4-4. Schematic Diagram ­Main Section (2/2)­ ........................ 13
5. EXPLODED VIEWS
5-1. Heat Sink Section .............................................................. 14
5-2. Main Board Section .......................................................... 14
6. ELECTRICAL PARTS LIST......................................... 15
Notes on Chip Component Replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.


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SECTION 1
GENERAL
This section is extracted
from instruction manual.


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