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SERVICE MANUAL
FM STEREO FM/AM RECEIVER
US Model
Canadian Model
AEP Model
Taiwan Model
Korean Model
Chinese Model
STR-DA7100ES
Ver. 1.3 2005.12
SPECIFICATIONS
9-879-764-04
2005L05-1
© 2005.12
Sony Corporation
Home Audio Division
Published by Sony Engineering Corporation
­ Continued on next page ­
This receiver incorporates Dolby* Digital and Pro
Logic Surround and the DTS** Digital Surround
System.
* Manufactured under license from Dolby
Laboratories.
"Dolby", "Pro Logic", "Surround EX", and the
double-D symbol are trademarks of Dolby
Laboratories.
** Manufactured under license from Digital
Theater Systems, Inc. U.S. Pat.
No's. 5,451,942; 5,956,674; 5,974,380;
5,978,762; 6,226,616; 6,487,535 and other U.S.
and world-wide patents issued and pending.
"DTS", "DTS-ES", "Neo:6", and "DTS 96/24"
are trademarks of Digital Theater Systems, Inc.
Copyright 1996, 2003 Digital Theater Systems,
Inc. All Rights Reserved.
AUDIO POWER
SPECIFICATIONS
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
(Models of area code US only)
With 8 ohm loads, both channels driven, from
20 ­ 20,000 Hz; rated 170 watts per channel
minimum RMS power, with no more than
0.15% total harmonic distortion from 250
milliwatts to rated output.
Amplifier section
Models of area code US, CND, TW:
POWER OUTPUT
Rated Power Output at Stereo Mode1)
(8 ohms 20 Hz ­ 20 kHz,
THD 0.15%):
170 W + 170 W
Reference Power Output at Stereo Mode
(4 ohms 20 Hz ­ 20 kHz,
THD 0.15%):
170 W + 170 W
Reference Power Output
(8 ohms 20 Hz ­ 20 kHz,
THD 0.15%)
FRONT
2): 170 W + 170 W
CENTER2): 170 W
SURR2): 170 W + 170 W
SURR BACK
2): 170 W +
170 W
Reference Power Output
(4 ohms 20 Hz ­ 20 kHz,
THD 0.15%)
FRONT
2): 170 W + 170 W
CENTER2): 170 W
SURR2): 170 W + 170 W
SURR BACK
2): 170 W +
170 W
Models of area code AEP, KR, CH:
POWER OUTPUT
Rated Power Output in Stereo Mode
1)
(8 ohms 1 kHz, THD
0.7%):
170 W + 170 W
Reference Power Output in Stereo Mode
(4 ohms 1 kHz, THD
0.7%):
170 W + 170 W
Reference Power Output
(8 ohms 1 kHz, THD
0.7%):
FRONT2): 170 W + 170 W
CENTER2): 170 W
SURR
2): 170 W + 170 W
SURR BACK2): 170 W +
170 W


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2
STR-DA7100ES
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES
SONT
CRITIQUES
POUR
LA
SÉCURITÉ
DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
· Abbreviation
CH : Chinese model
CND : Canadian model
KR : Korean model
TW : Taiwan model
Reference Power Output
(4 ohms 1 kHz, THD
0.7%):
FRONT2): 170 W + 170 W
CENTER2): 170 W
SURR2): 170 W + 170 W
SURR BACK2): 170 W +
170 W
1)Depending on the sound field settings and the
source, there may be no sound output.
2)Measured under the following conditions:
Frequency response
Inputs (Analog)
Inputs (Digital)
Outputs
EQUALIZER
FM tuner section
Tuning range
87.5 - 108.0 MHz
Antenna
FM wire antenna
Antenna terminals
75 ohms, unbalanced
Sensitivity
Mono:
18.3 dBf, 2.2
µV/75 ohms
Stereo:
38.3 dBf, 22.5
µV/75 ohms
Usable sensitivity 11.2 dBf, 1
µV/75 ohms
S/N
Mono:
76 dB
Stereo:
70 dB
Harmonic distortion at 1 kHz
Mono:
0.3%
Stereo:
0.5%
Separation
45 dB at 1 kHz
Frequency response 30 Hz ­ 15 kHz, +0.5/­2
dB
Selectivity60 dB at 400 kHz
AM tuner section
Tuning range
Models of area code US, CND:
530 ­ 1,710 kHz3)
(With 10-kHz tuning scale)
531 ­ 1,710 kHz3)
(With 9-kHz tuning scale)
Area code
Power requirements
US, CND
120 V AC, 60 Hz
TW
110 V AC, 60 Hz
AEP
230 V AC, 50/60 Hz
KR
230 V AC, 60 Hz
PHONO
RIAA equalization curve
± 0.5 dB
Power Amp Block
10 Hz ­ 50 kHz
± 3 dB (8 ohms)
PHONO
Sensitivity: 2.5mV
Impedance: 50kohms
S/N: 86dB (A, 20 kHz
LPF)
MULTI CHANNEL
INPUT1/2, SA-CD/CD,
TAPE, MD/DAT, DVD,
TV/SAT, VIDEO1/2/3
Sensitivity: 150mV
Impedance: 50kohms
S/N: 96dB (A, 20 kHz
LPF)
CH
230 V AC, 50 Hz
SA-CD/CD, DVD
(Coaxial)
Impedance: 75ohms
S/N: 96dB (A, 20 kHz
LPF)
SA-CD/CD, DVD,
TV/SAT, MD/DAT,
VIDEO 3 (Optical)
S/N: 96 dB
(A, 20 kHz LPF)
TAPE, MD/DAT
(REC OUT),
VIDEO1/2 (AUDIO OUT)
Voltage:150mV
Impedance: 10kohms
FRONT L/R, CENTER,
SURROUND L/R,
SURROUND BACK L/R,
SUB WOOFER
Voltage: 2V
Impedance: 1kohms
Gain levels
±10 dB, 1 dB step
Models of other area codes:
531 ­ 1,602 kHz
(With 9-kHz tuning scale)
Antenna
Loop antenna
Usable sensitivity
50 dB
µ/m (at 1,000 kHz or
999 kHz)
S/N
54 dB (at 50 mV/m)
Harmonic distortion 0.5% (50 mV/m, 400 Hz)
Selectivity
At 9 kHz:
35 dB
At 10 kHz:
40 dB
3)You can change the AM tuning scale to either 9
kHz or 10 kHz. After tuning in any AM station,
turn off the receiver. While holding down PRESET
TUNING + or TUNING +, press ?/1. All preset
stations will be erased when you change the tuning
scale. To reset the scale to 10 kHz (or 9 kHz),
repeat the procedure.
Video section
Inputs/Outputs
Video:
1 Vp-p, 75 ohms
S-video:
Y: 1 Vp-p, 75 ohms
C: 0.286 Vp-p, 75 ohms
COMPONENT VIDEO:
Y: 1 Vp-p, 75 ohms
PB/CB/B-Y: 0.7 Vp-p, 75
ohms
PR/CR/R-Y: 0.7 Vp-p, 75
ohms
80 MHz HD Pass Through
(When PROGRESSIVE
OUT is set to "OFF")
i.LINK section
Pin
4 pins
Transmission speed S200 (Maximum data
transmission speed 200
Mbps)
Transmission protocol
A/M transmission protocol
Format (input)
Super Audio CD* (DSD
PLAIN)
2 channel linear PCM
(IEC-60958-3)
Sampling frequency: 44.1
kHz
*Conforms to the copy protection technology of
DTLA (Revision 1.3).
General
Power requirements
Power consumption
Power consumption (during standby mode)
1 W
AC outlets
Dimensions
430
× 175 × 470 mm
(17
× 7 × 18 5/
8 in.)
including projecting parts
and controls
Mass (Approx.)
23.5 kg (51 lb. 13 oz.)
Supplied accessories
FM wire antenna (1)
AM loop antenna (1)
AC power cord (1)
Remote commander RM-AAE003 (1)
LR6 (size-AA) batteries (3)
Remote commander RM-US106A (1)
R6 (size-AA) batteries (2)
Design and specifications are subject to
change without notice.
Area code
Power requirements
US, CND
120 V AC, 60 Hz
AEP
230 V AC, 50/60 Hz
TW
110 V AC, 60 Hz
KR
220 V AC, 60 Hz
Area code
Power consumption
US, AEP, TW, KR,
CH
250 W
CND
300 VA
Area code
AC outlets
US, CND
2 switched, 120 W/1A MAX
AEP
1 switched, 100 W MAX
TW, KR, CH
­ (no AC outlet)
CH
220 V AC, 50 Hz
Ver 1.2


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3
STR-DA7100ES
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, "metallized" knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The "limit" indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15
µF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground


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4
STR-DA7100ES
TABLE OF CONTENTS
1.
SERVICING NOTES ................................................ 5
2.
GENERAL ................................................................... 13
3.
DISASSEMBLY
3-1.
Disassembly Flow .......................................................... 18
3-2.
Case ................................................................................ 18
3-3.
Front Panel Assy ............................................................. 19
3-4.
Bottom Plate ................................................................... 20
3-5.
D-AMP Board Block ...................................................... 20
3-6.
DC Fan Block ................................................................. 21
3-7.
Back Panel Block ........................................................... 21
3-8.
Mother COM Board ....................................................... 22
4.
TEST MODE .............................................................. 23
5.
ELECTRICAL ADJUSTMENTS ......................... 27
6.
DIAGRAMS
6-1.
Block Diagram ­ Audio Input Section ­ ...................... 61
6-2.
Block Diagram ­ Control Section ­ ............................. 62
6-3.
Block Diagram ­ i.LINK Section ­ .............................. 63
6-4.
Block Diagram ­ DSP Section ­ .................................. 64
6-5.
Block Diagram ­ Digital Audio Section ­ .................... 65
6-6.
Block Diagram ­ Audio Output Section ­ .................... 66
6-7.
Block Diagram ­ Power AMP Section ­ ...................... 67
6-8.
Block Diagram ­ SUB Section ­ .................................. 68
6-9.
Block Diagram ­ Video Input Section ­ ....................... 69
6-10. Block Diagram ­ CIS Display Section ­ ...................... 70
6-11. Block Diagram ­ HDMI Receiver Section ­ ................ 71
6-12. Block Diagram ­ HDMI Trasceiver Section ­ ............. 72
6-13. Block Diagram ­ Power Supply Section ­ ................... 73
6-14. Printed Wiring Board
­ Digital Board (Component Side) ­ .............................. 74
6-15. Printed Wiring Board
­ Digital Board (Conductor Side) ­ ............................... 75
6-16. Schematic Diagram ­ Digital Board (1/8) ­ ................. 76
6-17. Schematic Diagram ­ Digital Board (2/8) ­ ................. 77
6-18. Schematic Diagram ­ Digital Board (3/8) ­ ................. 78
6-19. Schematic Diagram ­ Digital Board (4/8) ­ ................. 79
6-20. Schematic Diagram ­ Digital Board (5/8) ­ ................. 80
6-21. Schematic Diagram ­ Digital Board (6/8) ­ ................. 81
6-22. Schematic Diagram ­ Digital Board (7/8) ­ ................. 82
6-23. Schematic Diagram ­ Digital Board (8/8) ­ ................. 83
6-24. Printed Wiring Board ­ DSP Board ­ ......................... 84
6-25. Schematic Diagram ­ DSP Board ­ ............................. 85
6-26. Printed Wiring Board
­ Analog Board (Component Side) ­ ............................. 86
6-27. Printed Wiring Board
­ Analog Board (Conductor Side) ­ ............................... 87
6-28. Schematic Diagram ­ Analog Board (1/4) ­ ................ 88
6-29. Schematic Diagram ­ Analog Board (2/4) ­ ................ 89
6-30. Schematic Diagram ­ Analog Board (3/4) ­ ................ 90
6-31. Schematic Diagram ­ Analog Board (4/4) ­ ................ 91
6-32. Schematic Diagram ­ Ilink Section (1/10) ­ ................ 92
6-33. Schematic Diagram ­ Ilink Section (2/10) ­ ................ 93
6-34. Schematic Diagram ­ Ilink Section (3/10) ­ ................ 94
6-35. Schematic Diagram ­ Ilink Section Board (4/10) ­ ..... 95
6-36. Schematic Diagram ­ Ilink Section (5/10) ­ ................ 96
6-37. Schematic Diagram ­ Ilink Section (6/10) ­ ................ 97
6-38. Schematic Diagram ­ Ilink Section (7/10) ­ ................ 98
6-39. Schematic Diagram ­ Ilink Section (8/10)­ ................. 99
6-40. Schematic Diagram ­ Ilink Section (9/10) ­ ................ 100
6-41. Schematic Diagram ­ Ilink Section (10/10) ­ .............. 101
6-42. Printed Wiring Board
­ Ilink Board (Component Side) ­ ................................. 102
6-43. Printed Wiring Board
­ ILINK Board (Conductor Side) ­ ................................ 103
6-44. Printed Wiring Board ­ Conect Boards ­ .................... 104
6-45. Schematic Diagram ­ Video Board (1/3) ­ .................. 105
6-46. Schematic Diagram ­ Video Board (2/3) ­ .................. 106
6-47. Schematic Diagram ­ Video Board (3/3) ­ .................. 107
6-48. Printed Wiring Board
­ Video Board (Component Side) ­ ............................... 108
6-49. Printed Wiring Board
­ Video Board (Conductor Side) ­ ................................. 109
6-50. Printed Wiring Board
­ S-video Board (Component Side) ­ ............................ 110
6-51. PPrinted Wiring Board
­ S-video Board (Conductor Side) ­ .............................. 111
6-52. Printed Wiring Board ­ Video3 Board ­ ..................... 112
6-53. Schematic Diagram ­ S-video Section ­ ...................... 113
6-54. Printed Wiring Board
­ Mother COM Board (Component Side) ­ ................... 114
6-55. Printed Wiring Board
­ Mother COM Board (Conductor Side) ­ ..................... 115
6-56. Schematic Diagram ­ Mother COM Board (1/3) ­ ...... 116
6-57. Schematic Diagram ­ Mother COM Board (2/3) ­ ...... 117
6-58. Schematic Diagram ­ Mother COM Board (3/3) ­ ...... 118
6-59. Printed Wiring Board
­ D-AMP Board (Component Side) ­ ............................ 119
6-60. Printed Wiring Board
­ D-AMP Board (Conductor Side) ­ .............................. 120
6-61. Schematic Diagram ­ D-AMP Board (1/4) ­ ............... 121
6-62. Schematic Diagram ­ D-AMP Board (2/4) ­ ............... 122
6-63. Schematic Diagram ­ D-AMP Board (3/4) ­ ............... 123
6-64. Schematic Diagram ­ D-AMP Board (4/4) ­ ............... 124
6-65. Printed Wiring Board ­ Filter-l Boards ­ .................... 125
6-66. Schematic Diagram ­ Filter-l Board ­ .......................... 126
6-67. Printed Wiring Board ­ Filter-R Boards ­ ................... 127
6-68. Schematic Diagram ­ Filter-R Board ­ ........................ 128
6-69. Printed Wiring Board
­ SP-Term COM Board (Component Side) ­ ................ 129
6-70. Printed Wiring Board
­ SP-Term Com Board (Conductor Side) ­ .................... 130
6-71. Schematic Diagram ­ SP-Term COM Board (1/3) ­ ... 131
6-72. Schematic Diagram ­ SP-Term COM Board (2/3) ­ ... 132
6-73. Schematic Diagram ­ SP-Term COM Board (3/3) ­ ... 133
6-74. Printed Wiring Board
­ CIS Board (Component Side) ­ ................................... 134
6-75. Printed Wiring Board
­ CIS Board (Conductor Side) ­ .................................... 135
6-76. Schematic Diagram ­ CIS Board ­ .............................. 136
6-77. Printed Wiring Board ­ FL Board ­ ............................ 137
6-78. Schematic Diagram ­ FL Board ­ ................................ 138
6-79. Printed Wiring Board ­ Panel Section ­ ...................... 139
6-80. Schematic Diagram ­ Panel Section ­ ......................... 140
6-81. Printed Wiring Board ­ Regulator Sections ­ ............. 141
6-82. Schematic Diagram ­ Regulator Sections ­ ................. 142
6-83. Printed Wiring Board ­ DC DIF Board ­ .................... 143
6-84. Schematic Diagram ­ DC DIF Boards ­ ...................... 144
6-85. Printed Wiring Board ­ AC DIF Section ­ .................. 145
6-86. Schematic Diagram ­ AC DIF Section ­ ...................... 146
7.
EXPLODED VIEWS
7-1.
Cover Section ................................................................. 165
7-2.
Front Panel Section-1 ..................................................... 166
7-3.
Front Panel Section-2 ..................................................... 167
7-4.
Chassis Section-1 ........................................................... 168
7-5.
Chassis Section-2 ........................................................... 169
7-6.
Chassis Section-3 ........................................................... 170
8.
ELECTRICAL PARTS LIST ............................... 171


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5
STR-DA7100ES
SECTION 1
SERVICING NOTES
· MODEL IDENTIFICATION
Model
PART No.
US and Canadian models
2-048-957-1[]
AEP model
2-048-957-2[]
Korean model
2-048-957-3[]
Taiwan model
2-048-957-4[]
Chinese model
2-048-957-5[]
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
· Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTE WHEN MEASURING THE VOLTAGE OF THE
CIRCUITS THAT USE VIRTUAL GROUND
This set contains the circuits that take grounding not from usual
ground but from virtual ground.
When measuring circuits in the D-AM and TERM COM boards
and the circuits in MOTHER COM and DC DIF boards that take
"VIRTUAL GND" or "V-GND" as a ground, take grounding from
CN3804 pin 2 of the MOTHER COM board.
NOTES ON REPLACEMENT OF ILINK BOARD
New part of flash memory (IC3001) on the ILINK board cannot be
used.
Therefore, if the mounted ILINK board is replaced, exchange new
flash memory (IC3001) with that used before the replacement.
NOTE OF HANDLING THE ILINK BOARD (Part No. A-
1126-993-A)
When the ILINK board is replaced by a repair for a fee, throw away
the ILINK board after obtaining consent of not returning of the
ILINK board to the customer. When throwing away the ILINK board,
be sure to throw away after destroying IC3205 and IC3208 physically
with the hammer etc.
PART No.
­ Back Panel ­
Ver 1.3