MICROFILM
SERVICE MANUAL
2-LINE CORDLESS TELEPHONE
US Model
SPECIFICATIONS
SPP-M932
2
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
1.
GENERAL
Setting up the base phone ...............................................
3
Preparing the battery pack ..............................................
5
Making calls ....................................................................
6
Receiving calls ................................................................
7
Speed dialing ...................................................................
8
Setting the ringer type .....................................................
9
Switching the phones during a call ................................. 10
Talking between the handset and
the base phone (Intercom) .............................................. 11
Having conference call ................................................... 12
Setting the digital security code ..................................... 14
Mounting the base phone on a wall ................................ 14
Carrying the handset by the belt clip .............................. 15
2.
DISASSEMBLY ......................................................... 16
3.
TEST MODE
3-1. Base Unit ......................................................................... 18
3-2. Handset ............................................................................ 18
3-3. Reprogram the Security Code ......................................... 18
4.
ELECTRICAL ADJUSTMENTS
4-1. Base Unit Section ............................................................ 19
4-2. Handset Section ............................................................... 20
5.
DIAGRAMS
5-1. Block Diagram BASE UNIT Section (1/2) .............. 21
5-2. Block Diagram BASE UNIT Section (2/2) .............. 23
5-3. Block Diagram HANDSET Section ......................... 25
5-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
5-5. Printed Wiring Board
BASE MAIN Board (Side A) ................................... 29
5-6. Printed Wiring Board
BASE MAIN Board (Side B) ................................... 31
5-7. Schematic Diagram
BASE MAIN Section (1/2) ....................................... 33
5-8. Schematic Diagram
BASE MAIN Section (2/2) ....................................... 35
5-9. Printed Wiring board
BASE KEY Section .................................................. 37
5-10. Schematic Diagram
BASE KEY Section .................................................. 38
5-11. Schematic Diagram
HAND MAIN Section .............................................. 39
5-12. Printed Wiring board
HAND MAIN Section .............................................. 41
5-13. Printed Wiring board
SHEET SWITCH Section ......................................... 43
5-14. IC Pin Function Description ........................................... 47
6.
EXPLODED VIEWS ................................................. 50
7.
ELECTRICAL PARTS LIST .................................. 52
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED
LINE WITH MARK
! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
3
SECTION 1
GENERAL
This section is extracted from
instruction manual.
4
5