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CD
Model Name Using Similar Mechanism PMC-D305L
Section
CD Mechanism Type
KSM-213CDM
Optical Pick-up Name
KSS-213C
TC
Model Name Using Similar Mechanism NEW
Section Tape Transport Mechanism Type
MF-ZW750-117
SERVICE MANUAL
AEP Model
UK Model
E Model
PHC-ZW770L
PERSONAL AUDIO SYSTEM
MICROFILM
CD player section
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wave length: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW
(This output is the value measured at a distance of
about 200 mm from the objective lens surface on
the optical pick-up block with 7 mm aperture.)
Spindle speed
200 r/min (rpm) to 500 r/min (rpm) (CLV)
Number of channels
2
Frequency response
20 - 20,000 Hz +1/­2 dB
Wow and flutter
Below measurable limit
Radio section
Frequency range
FM: EE and CET model
65 - 74 MHz
87.5 - 108 MHz
Except EE and CET model
87.5 - 108 MHz
MW: 531 - 1,602 kHz
LW: 153 - 279 kHz
IF
FM: 10.7 MHz
MW/LW: 450 kHz
Aerials:
FM: Telescopic antenna
MW/LW: Built-in ferrite bar antenna
SPECIFICATIONS
­ Continued on next page ­
Cassette-corder section
Recording system
4-track 2 channel stereo
Fast winding time
Approx. 120 s (sec.) with Sony cassette C-60
Frequency response
TYPE I (normal): 80 - 12,500 Hz
General
Speaker
Full range: 10 cm (4 in.) dia.,
6 ohms, cone type (2)
Outputs
Headphones jack (stereo minijack)
For 16 - 68 ohms impedance headphones
Maximum power output
4.5 W + 4.5 W
Power requirements
For personal audio system:
230 V AC, 50 Hz
9 V DC, 6 R20 (size D) batteries
For memory back-up:
4.5 V DC, 3 R6 (size AA) batteries
For remote controller:
3 V DC, 2 R6 (size AA) batteries
Power consumption
AC 28 W
Ver 1.0 1999. 03


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SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED LINE
WITH MARK
! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Battery life
For personal audio system:
FM recording
Sony R20P:
approx. 3.5 h
Sony alkaline LR20:
approx. 10 h
Tape playback
Sony R20P:
approx. 1.5 h
Sony alkaline LR20:
approx. 5 h
CD playback
Sony R20P:
approx. 1.5 h
Sony alkaline LR20:
approx. 4 h
For memory back-up: approx. 1 year
Dimensions
Approx. 630
× 268 × 256 mm (w/h/d)
(24 7/8
× 10 5/8 × 10 1/8 inches) (incl. projecting parts)
Mass
Approx. 7.9 kg (17 lb. 7 oz.) (incl. batteries)
Supplied accessories
AC power cord (1)
Remote controller RMT-CZW750AD (1)
Design and specifications are subject to change without
notice.
· Abbreviation
EE
: East European model
CET : East European & CIS model
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270°C during
repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on Chip Component Replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
This Compact Disc player is
classified as a CLASS 1
LASER product.
The CLASS 1 LASER
PRODUCT label is located
on the bottom exterior.


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CHUCK PLATE JIG ON REPAIRING
On repairing CD section, playing a disc without the CD lid, use
Chuck Plate Jig.
· Code number of Chuck Plate Jig: X-4918-255-1
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
1. Turn on OPERATE button and press CD button to CD position.
2. Open the CD lid.
3. Turn on S801 as following figure.
4. Press the
( P (CD) button.
5. Confirm the laser diode emission while observing the objecting
lens. When there is no emission, Auto Power Control circuit or
Optical Pick-up is broken.
Objective lens moves up and down three times for focus search.
S801
SERVICING NOTES


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TABLE OF CONTENTS
1. GENERAL
Playing a CD ........................................................................... 5
Listening to the radio ............................................................... 5
Playing a tape .......................................................................... 6
Recording on a tape ................................................................. 6
2. DISASSEMBLY
2-1. Cabinet Assy, Rear .............................................................. 7
2-2. Power Board ........................................................................ 7
2-3. CD Block Assy .................................................................... 8
2-4. MD Block Assy and Record/Playback Switch Board ......... 8
2-5. Main Board ......................................................................... 9
2-6. CD Board ............................................................................ 9
2-7. Optical Pick-up Section .................................................... 10
2-8. Control Board .................................................................... 10
2-9. Key Board and Lamp Board .............................................. 11
3. MECHANICAL ADJUSTMENTS ............................... 12
4. ELECTRICAL ADJUSTMENTS
Tape Section .......................................................................... 12
Tuner Section ......................................................................... 13
CD Section ............................................................................ 14
5. DIAGRAMS
5-1. IC Pin Description ............................................................. 15
5-2. Circuit Boards Location .................................................... 16
5-3. Block Diagram ­CD Section­ ........................................... 17
5-4. Block Diagram ­Main Section­ ........................................ 19
5-5. Printed Wiring Boards ­CD Section­ ............................... 21
5-6. Schematic Diagram ­CD Section­ .................................... 23
5-7. Printed Wiring Boards ­Control Section­ ......................... 25
5-8. Schematic Diagram ­Control Section­ ............................. 27
5-9. Printed Wiring Board ­Main Section­ .............................. 29
5-10. Schematic Diagram ­Main Section (1/2)­ ........................ 31
5-11. Printed Wiring Boards ­Power Supply Section­ .............. 34
5-12. Schematic Diagram ­Power Supply Section­ ................... 37
5-13. Schematic Diagram ­Main Section (2/2)­ ........................ 39
6. EXPLODED VIEWS
6-1. Cabinet (Rear) Section ...................................................... 45
6-2. Cabinet (Front) Section ..................................................... 46
6-3. CD Section ........................................................................ 47
6-4. Tape Mechanism Section-1 ............................................... 48
6-5. Tape Mechanism Section-2 (Deck A) ............................... 49
6-6. Tape Mechanism Section-3 (Deck A) ............................... 50
6-7. Tape Mechanism Section-4 (Deck B) ............................... 51
6-8. Tape Mechanism Section-5 (Deck B) ............................... 52
6-9. Optical Pick-up Section .................................................... 53
6-10. Speaker Section ................................................................. 54
7. ELECTRICAL PARTS LIST ......................................... 55


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SECTION 1
GENERAL
This section is extracted
from instruction manual.