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Conf
idential
SERVICE MANUAL
NOTEBOOK COMPUTER
· Design and specifications are subject to
change without notice.
·
Ver. 4 2003K
Revision History
PCG-V505F/V505T3x/V505W
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP
PCG-V505CP
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP
9-876-349-04
S400
Area
Model
Lineup
PCG-V505F/B
PCG-V505T3/Px
PCG-V505T3x
PCG-V505W/P
PCG-V505DC1x
PCG-V505DC1Px
PCG-V505DH
PCG-V505DX
PCG-V505DXP
European
AEP/UK
PCG-V505CP
Chinese
PCG-V505MCP
Korean
PCG-V505MLP
International
PCG-V505MP
Thai
PCG-V505MSP
Taiwan
PCG-V505MTP
: CTO Model
Asian/Oceania/
South Africa
Japanese
Japanese
American
US Canadian


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­ 2 ­
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
Information in this document is subject to
change without notice.
Sony, VAIO and CLIE are trademarks or regis-
tered trademarks of Sony. Microsoft,Windows,
Windows Media, Outlook, Bookshelf and other
Microsoft products are trademarks or registered
trademarks of Microsoft Corporation in the
United States and other countries.The word
Bluetooth and the Bluetooth logo are trademarks
of Bluetooth SIG, Inc. AMD, AMD logo, AMD
Duron and combinations there of, 3DNow!, are
trademarks of Advanced Micro Devices, Inc. Intel
Inside logo, Pentium and Celeron are trademarks
or registered trademarks of Intel Corporation.
Transmeta, the Transmeta logo, Crusoe Proces-
sor, the Crusoe logo and combinations there of
are trademarks of Transmeta Corporation in the
USA and other countries. Graffiti, HotSync,
PalmModem, and Palm OS are resistered trade-
marks, and the Hotsync logo and Palm are trade-
marks of Palm,Inc. or its subsidiaries. (M) and
Motrola are trademarks of Motrora, Inc. Other
Motrola products and services with (R) mark like
Dragomball are the trademarks of Motrola, Inc.
All other names of systems, products and
servicesin this manual are trademarks or regis-
tered trademarks of their respective owners. In
this manual, the (TM) or (R) mark are not speci-
fied.
Caution Markings for Lithium/Ion Battery - The
following or similar texts shall be provided on
battery pack of equipment or in both the operat-
ing and the service instructions.
CAUTION: Danger of explosion if battery is in-
correctly replaced. Replace only with the same
or equivalent type recommended by the manu-
facturer. Discard used batteries according to the
manufacturer's instructions.
CAUTION: The battery pack used in this device
may present a fire or chemical burn hazard if
mistreated. Do not disassemble, heat above
100ºC (212ºF) or incinerate. Dispose of used bat-
tery promptly. Keep away from children.
CAUTION: Changing the back up battery.
·Overcharging, short circuiting, reverse charg-
ing, multilati on or incineration of the cells must
be avoided to prevent one or more of the fol-
lowing occurrences; release of toxic materials,
release of hydrogen and/or oxygen gas, rise in
surface temperature.
· If a cell has leaked or vented, it should be re-
placed immediately while avoiding to touch it
without any protection.
Service and Inspection Precautions
1. Obey precautionary markings and
instructions
Labels and stamps on the cabinet, chassis, and
components identify are as requiring special pre-
cautions. Be sure to observe these precautions,
as well as all precautions listed in the operating
manual and other associated documents.
2. Use designated parts only
The set's components possess important safety
characteristics, such as noncombustibility and the
ability to tolerate large voltages. Be sure that re-
placement parts possess the same safety charac-
teristics as the originals. Also remember that the
0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particu-
larly important safety functions; be extra sure to
use only the designated components.
3. Al wa ys f ollo w the original
designwhen mounting parts and
routing wires
The original layout includes various safety fea-
tures, such as inclusion of insulating materials
(tubes and tape) and the mounting of parts above
the printer board. In addition, internal wiring has
been routed and clamped so as to keep it away
from hot or high-voltage parts. When mounting
parts or routing wires, therefore, be sure
toduplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all
screws, components, and wiring have been re-
turned to their original condition. Also check the
area around the repair location to ensure that re-
pair work has caused no damage, and confirm
safety.
5. When replacing chip components...
Never reuse components. Also remember that
the negative side of tantalum capacitors is easily
damaged by heat.
6. When handling flexible print
boards...
· The temperature of the soldering-iron tip
should be about 270ºC.
· Do not apply the tip more than three times to
the same pattern.
· Handle patterns with care; never apply force.
Caution: Remember that hard disk drives
areeasily damaged by vibration. Always
handlewith care.
ATTENTION AU COMPOSANT AYANT
RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE
MARQUE 0 SUR LES DIAGRAMMES
SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES
COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉR OS SONT DONNÉS
D ANSCE
MANUEL
OU
D ANS
LES
SUPPÉMENTS PUBLIÉS PAR SONY.


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­ 3 ­
Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
TABLE OF CONTENTS
Section
Title
Page
CHAPTER 1. SPECIFICATIONS ....................................................................................... 1-1
(to 1-1)
CHAPTER 2. BLOCK DIAGRAM ...................................................................................... 2-1
(to 2-1)
CHAPTER 3. FRAME HARNESS DIAGRAM ............................................................... 3-1
(to 3-1)
CHAPTER 4. EXPLODED VIEWS AND PARTS LIST
Palmrest
P-1 ........................................................................................................................................... 4-2
Bottom
B-1 .......................................................................................................................................... 4-3
Main Board
M-1 ......................................................................................................................................... 4-4
LCD
L-1 ........................................................................................................................................... 4-5
Accessories
A-1 .......................................................................................................................................... 4-6
(to 4-6)
History of the changes is shown as the "Revision
History" at the end of this data.
Section
Title
Page
"Revision History"
CHAPTER 5. OTHERS
5-1. The Barcode Label .................................................................................................................. 5-1
5-2. Replacing the CPU ................................................................................................................. 5-2
5-3. CTO Information .................................................................................................................... 5-3
(to 5-3)


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Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
1-1
(END)
CHAPTER 1.
SPECIFICATIONS
· The trademarks of registered trademarks of above table, refer to page 2.
· 2
EU
PCG-V505F/B
PCG-V505W/P
PCG-V505DH
PCG-V505DX
PCG-V505DXP
PCG-V505CP
PCG-V505MP
PCG-V506MLP
PCG-V505MSP
PCG-V505MTP
PCG-V505MCP
CPU
PM-1.3GHz
PM-1.5GHz
PM-1.4GHz
PM-1.4GHz
PM-1.4GHz
PM-1.6GHz
PM-1.5GHz
PM-1.5GHz
PM-1.5GHz
PM-1.5GHz
PM-1.5GHz
LCD
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
12.1XGA
HDD
40GB
60GB
40GB
60GB
60GB
40GB
40GB
40GB
40GB
40GB
40GB
Graphics
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
M9+X(32MB)
MEMORY1
256MB
× 1
512MB
× 1
256MB
× 2
256MB
× 2
256MB
× 2
512MB
× 1
512MB
× 1
512MB
× 1
512MB
× 1
512MB
× 1
512MB
× 1
QUANTITY
[STANDARD/MAX]
256MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
512MB/2GB
OPT-DRIVE
CD-RW/DVD-ROM
CD-RW/DVD-ROM
CD-RW/DVD-ROM
CD-RW/DVD-ROM
CD-RW/DVD-ROM
CD-RW/DVD-ROM
CD-RW/DVD-ROM
CD-RW/DVD-ROM
Combo 9.5
Combo 9.5
Combo 9.5
internal W-LAN
aaaaaaaa
aaa
AC adaptor
PCGA-AC16V6
PCGA-AC16V6
PCGA-AC16V6
PCGA-AC16V6
PCGA-AC16V7
PCGA-AC16V7
PCGA-AC16V7
PCGA-AC16V7
PCGA-AC16V6
PCGA-AC16V6
PCGA-AC16V6
Battery
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
PCGA-BP2V
OS
WinXP Home
WinXP Pro
XP Home
XP Home
XP Pro
XP Pro
XP Pro
XP Pro
XP Pro
XP Pro
XP Pro
AM
J
AO
2
[MA]
2
[MA]
2
[MA]
2
[MA]
2
[MA]
2
[MA]
3
[MA]
3
[MA]
3
[MA]


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Confidential
PCG-V505F/V505T3x/V505W (J)
PCG-V505DC1x/V505DC1Px/V505DH/V505DX/V505DXP (AM)
PCG-V505CP (EU)
PCG-V505MCP/V505MP/V505MLP/V505MSP/V505MTP (AO)
2-1
(END)
Microphone
DVI-D
PC Card
(Type II x 1)
i.LINK
RJ-45
RJ-11
Intel®
82801DBM
421 BGA
(ICH4-M)
Intel®
Pentium® M
Processor
478 mFCPGA
Graphics
ATI M9+
Audio
CODEC
MDC Modem
HDD
Opt.
Drive
SO-DIMM
SO-DIMM
LCD
12" XGA
MS
ATF0
LM86
Thermal
Sensor
LM26
Thermal
Sensor
LM26
ATF1
LM75
EEPROM
(MAC address)
EEPROM
(password)
Battery
400 MHz
PSB
HUB
Interface
66 MHz
333 MHz
DDR
SDRAM
AGP 4X
(264 MHz)
VIF-33
IFX-290
CNX-201
CNX-206
PCI Bus
(33 MHz)
Headphone
Internal Keyboard
TouchPad
LVDS
LPC (33
MHz)
VGA
VGA
Intel® 855PM
MCH
593
mFCBGA
(ODEM)
Clock
Gen.
DC Jack
(16 V)
MBX-100
EEPROM
(GUID)
AC'97
Bus
USB
IDE
(Ultra ATA100)
Ether
Kinnereth
RJ-45
DC Jack
(16 V)
USB-
Parallel
USB
(left)
USB
(right)
Memory
Stick
(SUMIRE 3)
CNX-227
FWH
EC/K
BC
Debug
CNX-226
i.LINK
&
PC Card
W-LAN
(Mini PCI
Type 3B socket)
USB 2.0
Hub
DC/DC
USB
USB
Parallel
USB
port3
Port 0
Port 2
Port 4
Port 5
port1
(socket)
TMDS
PCGA-PRV1
CHAPTER 2.
BLOCK DIAGRAM