Conf
idential
PCG-FXA63
SERVICE MANUAL
NOTEBOOK COMPUTER
9-874-586-02
For American Area
US Model
CanadianModel
Lineup : PCG-FXA63
· Design and specifications are subject to
change without notice.
S400
Ver 2-2003L
Revision History
-- 2 --
Information in this document is subject to change without notice.
Sony, VAIO and CLIE are trademarks or registered trademarks of
Sony. Microsoft, Windows, Windows Media, Outlook, Bookshelf
and other Microsoft products are trademarks or registered trademarks
of Microsoft Corporation in the United States and other countries.
The word Bluetooth and the Bluetooth logo are trademarks of
Bluetooth SIG, Inc. AMD, AMD logo, AMD Duron and
combinations thereof, 3DNow!, are trademarks of Advanced Micro
Devices, Inc. Intel Inside logo, Pentium and Celeron are trademarks
or registered trademarks of Intel Corporation. Transmeta, the
Transmeta logo, Crusoe Processor, the Crusoe logo and
combinations thereof are trademarks of Transmeta Corporation in
the USA and other countries. Graffiti, HotSync, PalmModem, and
Palm OS are resistered trademarks, and the Hotsync logo and Palm
are trademarks of Palm, Inc. or its subsidiaries. (M) and Motrola
are trademarks of Motrora, Inc. Other Motrola products and services
with (R) mark like Dragomball are the trademarks of Motrola, Inc.
All other names of systems, products and services in this manual
are trademarks or registered trademarks of their respective owners.
In this manual, the (TM) or (R) mark are not specified.
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions. Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.
2. Use designated parts only
The set's components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the 0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.
3. Always follow the original design when mounting
parts and routing wires
The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board. In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts. When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition. Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negative side of tantalum
capacitors is easily damaged by heat.
6. When handling flexible print boards...
· The temperature of the soldering-iron tip should be about 270C.
· Do not apply the tip more than three times to the same pattern.
· Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.
Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer. Discard used batteries according to the
manufacturer's instructions.
CAUTION: The battery pack used in this device may present a fire
or chemical burn hazard if mistreated. Do not disassemble, heat
above 100
°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
CAUTION: Changing the back up battery.
· Overcharging, short circuiting, reverse charging, multilation or
incineration of the cells must be avoided to prevent one or more of
the following occurrences; release of toxic materials, release of
hydrogen and/or oxygen gas, rise in surface temperature.
· If a cell has leaked or vented, it should be replaced immediately
while avoiding to touch it without any protection.
PCG-FXA63 (AM)
Confidential
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
-- 3 --
TABLE OF CONTENTS
Section
Title
Page
PCG-FXA63 (AM)
Confidential
CHAPTER 1. BLOCK DIAGRAM ............................... 1-1
(to 1-2)
CHAPTER 2. FRAME HARNESS DIAGRAM ........ 1-1
(to 1-2)
CHAPTER 3. EXPLODED VIEWS AND
PARTS LIST ............................................ 3-1
3-1. Main Section .................................................................... 3-2
3-2. FDD Section .................................................................... 3-5
3-3. LCD Section Made by AC ......................................... 3-7
3-4. Connector Section (CH Type Only) ................................. 3-9
(to 3-10)
CHAPTER 4. OTHERS
4-1. Replacing the CPU .......................................................... 4-1
1. Removing the CPU .......................................................... 4-1
2. Installing the CPU ............................................................ 4-1
History of the changes is shown as the
"Revision History" at the end of this data.
Confidential
PCG-FXA63 (AM)
(END)
1-2
1-1
CHAPTER 1.
BLOCK DIAGRAM
T
FI
PCI BUS
CLK GEN
ICS9248BF-
168
CPU CLOCK
PCI CLOCK
USB CLOCK
2
Main System Board MBX-61
DC-IN
14M CLOCK
4
LCD Panel
SXGA+/XGA
CARDBUS
TI PCI1420
P
C
Card
Socket
1
P
C
Card
Socket
2
PCU
NS KBC
PC 87570
ISA
BATTERY 0
T/P BOARD
CNX-129
DC/DC BOARD
PWS-14
I/O SUB BOARD CNX-150
USB 1
Serial
DSUB -9
R J-11
CN
2
-pin
POWER CIRCUIT
MAXIM 1711
MAXIM 1632A
CPU-VCC
CORE
3V/3 VSUS
5V/5 VSUS
1
3
2
PCG-FX Series
BLOCK DIAGRAM Rev.
A
CN
18
-p in
Main Memory
PC133 SO-DIMM
SO-DIMM
Slot B
North Bridge
VIA KT133A
VT8363A
DRAM
SIGNAL
ADDR
ESS
D
ATA
CTRL
SIGN
A
L
CPU
AMD Mobile AthlonXP
Processor
462 PIN PGA SOC KET A
Graphic
ATI 3D RAGE
Mobility- M1
AGP
NTSC /PAL
TV out
LCD S ig
TV Sig
Card bus
Signal
BATTERY 1
USB 0
USBP0
Touch
Pad
BIOS
Flash
4Mbit
MAX3243
COM
SIGNAL
P arallel
DSU B-25
LPT
3
i.LINK
4-pin
LAN
Real tek
RTL8139 CL
LAN
R J-45
i.LINK
TI
TSB12L V26
PHY
TI
TSB41L V01
PS /2
SO-DIMM
Slot A
RGB
VGA
LID
CN
60
-p in
VIN
Secondary IDE Bus
CN
Optical
Devices
Primary IDE Bus
CN
HDD
SOUTH BRIDGE
VIA VT82C686-B
U SBP1
U SBP2
U SBP3
KBD
AC97
AD1881A
5
Headphone
Amp
TPA0132
POWER SWITCH
BOA RD SWX-74
CN
CN
S P_L
S P_R
CN
10
-pin
POW
E xt. MIC
4
Mini PCI MDC
CN
30 -pin
MODEM
DAA
AC LINK
5
AC LI NK
FDD
VA
1
VIN
14.1/15.0
Confidential
PCG-FXA63 (AM)
(END)
2-2
2-1
CHAPTER 2.
FRAME HARNESS DIAGRAM
KEY BOARD
DC FAN
CPU
VIDEO OUT
EXTERNAL MICROPHONE
HEADPHONE
IEEE 1394 i.LINK
PCN1
CON13
CON4
CON5
CON18
CON17
CON8
CPU1
CON1
1
250
49
Side
PC CARD
CONNECTOR
RAM
RAM
BATTERY PACK
PWS-14 Board
(Side-B)
CNX-129 Board
(Side-B)
TOUCH PAD
OPTICAL
DEVICES
FLOPPY DISK
DRIVE
2nd BATTERY PACK
(OPTION)
SWX-74
(Side-A)
CARD MODEM
MBX-61 Board
(Side-A)
J1
Speaker L
Speaker R
CNX-150 Board
(Side-A)
Rear Panel
PHONE
PRINTER
SERIAL
USB
NETWORK
MONITOR
DC-IN
USB
LCD
INVERTER
HARD DISK
FFC LED
1
3
2
1
143
144
1
2
60
59
1
1
1
6
6
1
2
2
1
60
59
2
1
143
144
CON14
CON2
CON22
BCN1
JP1
JP2
CON7
1
75
150
76
FPC
FPC
CON10
CON3
BCN4
BCN3
49
50
50
BCN2
1
2
1
12
8
8
1
7
PL1
CON6
CON11
CON21
CON15
CON19
CON9
CON23
CON20
18
1
1
1
1
50
25
26
10
2
2
2
9
1
50
49
4
99
100
1
CON12
1
2
29
30
1
1
1
1
10
2
2
2
29
30
JP2
JP1
JP3
JP1
2
18
1
CON2
CON2
CON1 CON3
CON4
1
SLOT B
SLOT A
PC-133 SO-DIMM
From board to connector (direct connection)
Harness (connector at both end)
Harness (soldered at one end)
Connectors soldered on board and appearing on the panel