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SERVICE MANUAL
PORTABLE HARD DISK AUDIO PLAYER
US Model
AEP Model
UK Model
E Model
Australian Model
Chinese Model
Tourist Model
SPECIFICATIONS
NW-HD5
Ver. 1.4 2005.09
9-879-662-05
2005I05-1
© 2005.09
Sony Corporation
Connect Company
Published by Sony Engineering Corporation
Supplied Accessories


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2
NW-HD5
TABLE OF CONTENTS
1.
SERVICING NOTES ............................................... 3
2.
GENERAL ................................................................... 4
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
5
3-2.
Battery Case Lid ..............................................................
6
3-3.
Cabinet (Main) Block Assy .............................................
6
3-4.
Cabinet (Upper) Block Assy ............................................
7
3-5.
HDD Unit ........................................................................
7
3-6.
MAIN Board Section .......................................................
8
3-7.
MAIN Board ....................................................................
8
3-8.
Position of Ferrite Core ...................................................
9
4.
TEST MODE .............................................................. 10
5.
DIAGRAMS
5-1.
Block Diagram ­ MAIN Section (1/2) ­ ......................... 18
5-2.
Block Diagram ­ MAIN Section (2/2) ­ ......................... 19
5-3.
Block Diagram ­ KEY/POWER SUPPLY Section ­ ...... 20
5-4.
Printed Wiring Board
­ MAIN Board (Component Side) ­ ............................... 22
5-5.
Printed Wiring Board
­ MAIN Board (Conductor Side) ­ ................................. 23
5-6.
Schematic Diagram ­ MAIN Board (1/7) ­ .................... 24
5-7.
Schematic Diagram ­ MAIN Board (2/7) ­ .................... 25
5-8.
Schematic Diagram ­ MAIN Board (3/7) ­ .................... 26
5-9.
Schematic Diagram ­ MAIN Board (4/7) ­ .................... 27
5-10. Schematic Diagram ­ MAIN Board (5/7) ­ .................... 28
5-11. Schematic Diagram ­ MAIN Board (6/7) ­ .................... 29
5-12. Schematic Diagram ­ MAIN Board (7/7) ­ .................... 30
5-13. Printed Wiring Board ­ HDD Board ­ ............................ 31
5-14. Schematic Diagram ­ HDD Board ­ ............................... 31
6.
EXPLODED VIEW
6-1.
Overall Section ................................................................ 44
6-2.
Main Section .................................................................... 45
7.
ELECTRICAL PARTS LIST ................................ 46
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Ver. 1.3


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3
NW-HD5
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
· Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
· Replacement of CXR704060-201GA (IC1003),
S1R72003BOOA100 (IC2001), CXR710160-213GH
(IC3001), CXD1616GH (IC7001), MT48H8M16LFB4-10
(IC7002) and SC901584EPR2 (IC9003) used in this set
requires a special tool.
· When IC1101 and IC1102 (IC1102 is mounted only E, Taiwan,
Korean, Chinese and Tourist models) on the MAIN board are
damaged, exchange the new MAIN board for the MAIN board
which IC damaged.
SYSTEM REQUIREMENTS
Ver. 1.3


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4
NW-HD5
SECTION 2
GENERAL
This section is extracted from
instruction manual.


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NW-HD5
5
· This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
SECTION 3
DISASSEMBLY
3-2. BATTERY CASE LID
(Page 6)
3-3. CABINET (MAIN) BLOCK ASSY
(Page 6)
3-4. CABINET (UPPER) BLOCK ASSY
(Page 7)
3-5. HDD UNIT
(Page 7)
3-6. MAIN BOARD SECTION
(Page 8)
3-7. MAIN BOARD
(Page 8)
3-8. POSITION OF FERRITE CORE
(Page 9)
SET