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MZ-G750/G750DPC/R700/R700DPC/R700PC
SERVICE MANUAL
FM/AM PORTABLE MINIDISC RECORDER
Model Name Using Similar Mechanism
NEW
Mechanism Type
MT-MZR700-172
Optical Pick-up Name
LCX-4R
(Photo: MZ-G750)
MD recorder
Audio playing system
MiniDisc digital audio system
Laser diode properties
Material: GaAlAs MQW
Wavelength:
= 790 nm
Emission duration: continuous
Laser output: less than 44.6
µW
(This output is the value measured at a
distance of 200 mm from the lens surface
on the optical pick-up block with 7 mm
aperture.)
Recording and playback time
When using MDW-80
Maximum 160 min. in monaural
Maximum 320 min. in stereo
Revolutions
350 rpm to 2,800 rpm (CLV)
Error correction
ACIRC (Advanced Cross Interleave Reed
Solomon Code)
Sampling frequency
44.1 kHz
Sampling rate converter
Input: 32 kHz/44.1 kHz/48 kHz
Coding
ATRAC (Adaptive TRansform Acoustic
Coding)
ATRAC3-LP2
ATRAC3-LP4
Modulation system
EFM (Eight to Fourteen Modulation)
SPECIFICATIONS
Number of channels
2 stereo channels
1 monaural channel
Frequency response
20 to 20,000 Hz ± 3 dB
Wow and Flutter
Below measurable limit
Inputs
Microphone: stereo mini-jack, minimum
input level 0.25 mV
Line in: stereo mini-jack, minimum input
level 49 mV
Optical (Digital) in: optical (digital) mini-
jack
Outputs
i
: stereo mini-jack, maximum output level
5 mW + 5 mW, load impedance 16 ohm
Radio (MZ-G750/G750DPC)
Frequency range
AM: 530-1,710 kHz (US and
Central and South America models)
531-1,602 kHz (Other models)
FM: 87.5-108.0 MHz
General
Power requirements
Sony AC Power Adaptor (supplied)
connected at the DC IN 3 V jack:
120 V AC, 60 Hz (U.S.A.,Canadian and
Taiwan model)
230 V AC, 50/60 Hz (AEP model)
240 V AC, 50 Hz (Australian model)
220 V AC, 50 Hz (Chinese model)
230-240 V AC, 50 Hz (UK and Hong
Kong model)
220 V AC, 50 Hz (Argentina model)
110/220 V AC, 60 Hz (Korean model)
100-240 V AC, 50/60 Hz (Other models)
Nickel cadmium rechargeable battery
NC-WMAA (supplied)
LR6 (size AA) alkaline battery (not
supplied)
­ Continued on next page ­
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.
Ver 1.0 2001. 01
MZ-G750/G750DPC
PORTABLE MINIDISC RECORDER
MZ-R700/R700DPC/R700PC
Ver 1.0 2002. 02
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-873-629-01
2002B0400-1
© 2002.02
US Model
MZ-G750DPC/R700/R700DPC
Canadian Model
MZ-R700PC
AEP Model
UK Model
MZ-G750/R700/R700PC
E Model
Australian Model
Tourist Model
MZ-G750/R700
Chinese Model
MZ-R700
This service manual contains the
information on the MZ-G750/R700,
MZ-G750DPC/R700DPC and
MZ-R700PC (9-873-045-12,
9-873-126-11 and 9-873-134-11).


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Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270°C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Battery operation time
Battery life1) (MZ-G750/G750DPC)
When recording2)
(Unit: approx.hours) (EIAJ3))
Batteries
Stereo
LP2
LP4
NC-WMAA Nickel Cadmium
4
6
7.5
rechargeable battery4)
LR6 (SG) Sony alkaline dry
96)
136)
166)
battery5)
1)
The battery life may be shorter due to operating conditions and the
temperature of the location.
2)
When you record, use a fully charged rechargeable battery.
3)
Measured in accordance with the EIAJ (Electronic Industries
Association of Japan) standard.
4)
When using a 100% fully charged rechargeable battery.
5)
When using a Sony LR6 (SG) "STAMINA" alkaline dry battery
(produced in Japan).
6)
Recording time may differ according to the alkaline batteries.
When playing
(Unit: approx.hours) (EIAJ1))
Batteries
Stereo
LP2
LP4
NC-WMAA Nickel Cadmium
11.5
14
16
rechargeable battery2)
LR6 (SG) Sony alkaline dry
36
42
48
battery3)
1)
Measured in accordance with the EIAJ (Electronic Industries
Association of Japan) standard.
2)
When using a 100% fully charged rechargeable battery.
3)
When using a Sony LR6 (SG) "STAMINA" alkaline dry battery
(produced in Japan).
When using the radio
(EIAJ1))
Batteries
Approx. hours
NC-WMAA Nickel Cadmium rechargeable
9.5
battery2)
LR6 (SG) Sony alkaline dry battery3)
28.5
1)
Measured in accordance with the EIAJ (Electronic Industries
Association of Japan) standard.
2)
When using a 100% fully charged rechargeable battery.
3)
When using a Sony LR6 (SG) "STAMINA" alkaline dry battery
(produced in Japan).
Battery life1) (MZ-R700/R700DPC/R700PC) (Unit: approx.hours) (EIAJ2))
Batteries
Stereo
LP2
LP4
NC-WMAA Nickel Cadmium
Recording
4
6
7.5
rechargeable battery3)
Playback
13
14.5
18
LR6 (SG) Sony alkaline dry
Recording
9
13
16
battery4)
Playback
40
46
53
1)
The battery life may be shorter due to operating conditions and the
temperature of the location.
2)
Measured in accordance with the EIAJ (Electronic Industries
Association of Japan) standard.
3)
When using a 100% fully charged rechargeable battery.
4)
When using a Sony LR6 (SG) "STAMINA" alkaline dry battery
(produced in Japan).
Dimensions
Approx. 81
× 28.1 × 74.4 mm (w/h/d)
(3 1/4
× 1 1/8 × 3 in.) without projections.
Mass
Approx. 118 g (4.2 oz) the recorder only (MZ-G750/G750DPC)
Approx. 116 g (4.1 oz) the recorder only (MZ-R700/R700DPC/R700PC)
Supplied accessories
AC power adaptor (1)
Headphones/earphones with a remote control (1)
Optical cable (1)
NC-WMAA nickel cadmium rechargeable
battery (1)
Rechargeable battery carrying case (1)
Carrying pouch/carrying case with a belt clip (except U.S.A model) (1)
Design and specifications are subject to change
without notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
MZ-G750/G750DPC/R700/R700DPC/R700PC


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1. SERVICING NOTE ......................................................... 4
2. GENERAL
Looking at the Controls (MZ-G750/G750DPC) ................. 5
Looking at the Controls (MZ-R700/R700DPC/R700PC) .. 6
3. DISASSEMBLY
3-1. Panel Assy, Lower ............................................................... 7
3-2. Panel Assy, Upper ............................................................... 7
3-3. LCD Module ....................................................................... 8
3-4. Main Board ......................................................................... 8
3-5. MD Mechanism Deck ......................................................... 9
3-6. Service Assy, OP ................................................................. 9
3-7. Holder Assy ....................................................................... 10
3-8. Motor Flexible Board ........................................................ 10
3-9. Motor, DC (M602) ............................................................ 11
3-10. "Motor, DC (M601)", "Motor, DC (M603)" .................... 11
4. TEST MODE
4-1. Outline ............................................................................... 12
4-2. Setting Method of Test Mode ............................................ 12
4-3. Operation in Setting the Test Mode ................................... 12
4-4. Releasing the Test Mode ................................................... 12
4-5. Configuration of Test Mode .............................................. 13
4-6. Manual Mode .................................................................... 13
4-7. Overall Adjustment Mode ................................................. 14
4-8. Self-Diagnosis Result Display Mode ................................ 14
4-9. Result the Error Display Code .......................................... 15
4-10. Sound Skip Check Result Display Mode .......................... 16
4-11. Key Check Mode ............................................................... 16
TABLE OF CONTENTS
5. ELECTRICAL ADJUSTMENTS
5-1. Outline ............................................................................... 18
5-2. Precautions for Adjustment ............................................... 18
5-3. Adjustment Sequence ........................................................ 18
5-4. NV Reset ........................................................................... 18
5-5. Power Supply Manual Adjustment .................................... 19
5-6. Temperature Correction ..................................................... 20
5-7. Laser Power Check ........................................................... 20
5-8. Overall Adjustment Mode ................................................. 21
5-9. Resume Clear .................................................................... 23
5-10. Patch Data Rewriting when Nonvolatile
Memory was Replaced ...................................................... 23
6. DIAGRAMS
6-1. IC Pin Function Description ............................................ 29
6-2. Block Diagram ­ Servo Section ­ ..................................... 35
6-3. Block Diagram ­ Audio Section ­ .................................... 36
6-4. Block Diagram ­ System Control/Power Section ­ .......... 37
6-5. Printed Wiring Board ­ Main Section ­ ............................ 38
6-6. Schematic Diagram ­ Main Section (1/3) ­ ...................... 41
6-7. Schematic Diagram ­ Main Section (2/3) ­ ...................... 42
6-8. Schematic Diagram ­ Main Section (3/3) ­ ...................... 43
7. EXPLODED VIEWS
7-1. Panel Section ..................................................................... 47
7-2. Chassis Section ................................................................. 48
7-3. MD Mechanism Deck Section .......................................... 49
8. ELECTRICAL PARTS LIST ...................................... 50
MZ-G750/G750DPC/R700/R700DPC/R700PC


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MZ-G750/G750DPC/R700/R700DPC/R700PC
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(LCX-4R)
The laser diode in the optical pick-up block may suffer electro-
static break-down easily. When handling it, perform soldering
bridge to the laser-tap on the flexible board. Also perform mea-
sures against electrostatic break-down sufficiently before the op-
eration. The flexible board is easily damaged and should be handled
with care.
OPTICAL PICK-UP FLEXIBLE BOARD
· In performing the repair with the power supplied to the set,
removing the MAIN board causes the set to be disabled.
In such a case, fix a convex part of the open/close detect switch
(S806 on MAIN board) with a tape in advance.
Handle the FLEXIBLE board (over write head) with care, as it
has been soldered directly to the MAIN board.
In repairing the component side of MAIN board, connect the
FLEXIBLE board (over write head) and the MAIN board with
the lead wires in advance. (See page 8)
· Replacement of CDX2671-204GA (IC801) used in this set
requires a special tool.
· On the set having the microcomputer version 1.000, some
adjusted values were set in the manual mode at the shipment,
but these data will be cleared when the NV is reset. Therefore,
on the set having the microcomputer version 1.000, change the
adjusted values following the Change of Adjusted Values
immediately after the NV was reset. (See page 18)
· If the nonvolatile memory was replaced on the set, the modified
program data must be written to the nonvolatile memory. In such
a case, write the modified data that meets the microcomputer
version following the patch data rewriting procedure at the
replacement of nonvolatile memory. (See page 23)
laser-tap
S806
MAIN board
FLEXIBLE board
(Over write head)
Tape
panel assy, upper


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MZ-G750/G750DPC/R700/R700DPC/R700PC
SECTION 2
GENERAL
This section is extracted from
instruction manual.
(MZ-G750/G750DPC)