SONY MZE60 - Service Manual Immediate Download

MICROFILM

MZ-E60

SERVICE MANUAL

PORTABLE MINIDISC PLAYER

SPECIFICATIONS

US Model

Canadian Model

AEP Model

E Model

System

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material: GaAlAs

Wavelength:

= 790 nm

Emission duration: continuous

Laser output: less than 44.6

µW

(This output is the value measured at a distance

of 200 mm from the objective lens surface on the

optical pick-up block with 7 mm aperture.)

Revolutions

800 rpm to 1,800 rpm

Error correction

Advanced Cross Interleave Reed Solomon

Code (ACIRC)

Sampling frequency

44.1 kHz

Coding

Adaptive TRansform Acoustic Coding (ATRAC)

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels

1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limit

Outputs

Headphones: stereo mini-jack,

maximum output level 5 mW + 5 mW, load

impedance 16 ohms

General

Power requirements

One LR6 (size AA) battery (not supplied)

Battery operation time

You can check the battery condition with the

battery indication which is displayed while using

the player.

t Battery power decreasing

r Weak battery

e The battery has gone out. "LOW BATT"

flashes in the display on the remote control,

and the power goes off.

Battery Life

Approximately 12 hours of playback can be

expected with one LR6 (size AA) alkaline battery

(not supplied).

Note

The battery life may shorter depending on

operating conditions and temperature of the

location.

Continued on next page

US and foreign patents licensed from Dolby

Laboratories Licensing Corporation.

Model Name Using Similar Mechanism

MZ-E90

MD Mechanism Type

MT-MZE60-169

Optical Pick-up Mechanism Type

LCX-2E

(Photo: Silver)

Ver 1.1 2000. 06

With SUPPLEMENT-1

(9-927-633-81)

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK

0 OR DOTTED LINE WITH

MARK

0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE

PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN

SUPPLEMENTS PUBLISHED BY SONY.

Flexible Circuit Board Repairing

· Keep the temperature of the soldering iron around 270°C

during repairing.

· Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

· Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

· Never reuse a disconnected chip component.

· Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Precautions for Laser Diode Emission Check

When checking the emission of the laser diode during adjust-

ments, never view directly downwards as this may lead to

blindness.

Precautions for Using Optical Pick-up (LCX-2E)

As the laser diode inside the optical pick-up damages by static

electricity easily, solder the laser tap of the Optical pick-up

flexible board when handling. Also take the necessary measures

to prevent damages by static electricity. Handle the Optical pick-

up flexible board with care as it breaks easily.

Laser tap

Optical Pick-up flexible board

CAUTION

Use of controls or adjustments or performance of procedures

other than those specified herein may result in hazardous

radiation exposure.

IN NO EVENT SHALL SELLER BE

LIABLE FOR ANY DIRECT,

INCIDENTAL OR CONSEQUENTIAL

DAMAGES OF ANY NATURE, OR

LOSSES OR EXPENSES RESULTING

FROM ANY DEFECTIVE PRODUCT

OR THE USE OF ANY PRODUCT.

"MD WALKMAN" is a trademark of Sony

Corporation.

This MiniDisc player is classi-

fied as a CLASS 1 LASER

product.

The CLASS 1 LASER

PRODUCT label is located on

the bottom exterior.

Dimensions

Approx. 81

× 25 × 74 mm (w/h/d)

(3 1/4

× 1 × 3 in.) not including projecting

parts and controls

Mass

Approx. 95 g (3.4 oz.) the player only

Approx. 136 g (4.8 oz.) incl. a premastered MD

and a LR6 (size AA) alkaline battery

Supplied accessories

Headphones with a remote control (1)

Carrying pouch (1)

Design and specifications are subject to change

without notice.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE

0 SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES

SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.

NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES

SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL

OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

1. SERVICING NOTE ......................................................... 4

2. GENERAL ......................................................................... 5

Playing an MD right away! ................................................... 5

3. DISASSEMBLY ............................................................... 7

3-1. Panel Assy, Upper ................................................................. 7

3-2. Holder Assy ........................................................................... 7

3-3. Mechanism Deck .................................................................. 8

3-4. Main Board ........................................................................... 8

3-5. Service Assy, OP ................................................................... 9

4. TEST MODE ................................................................... 10

4-1. General ................................................................................ 10

4-2. Setting the Test Mode ......................................................... 10

4-2-1. How to Set the Test Mode ........................................... 10

4-2-2. Operations when the Test Mode is Set ........................ 10

4-2-3. How to Release the Test Mode .................................... 10

4-3. Test Mode Structure ............................................................ 10

4-4. Manual Mode ...................................................................... 11

4-4-1. Outline of the Function ............................................... 11

4-4-2. How to Set the Manual Mode ...................................... 11

4-5. Overall Adjustment Mode ................................................... 11

4-5-1. Outline of the Function ............................................... 11

5. ELECTRICAL ADJUSTMENTS .............................. 12

5-1. General ................................................................................ 12

5-2. Notes for Adjustment .......................................................... 12

5-2-1. Jigs ............................................................................... 12

5-2-2. Adjustment Sequence .................................................. 12

5-2-3. Power ........................................................................... 12

5-3. Reset NV ............................................................................. 12

5-3-1. How to Reset NV ........................................................ 12

5-4. Overall Adjustment Mode ................................................... 12

5-4-1. Overall Adjustment Mode Structure ............................ 12

5-4-2. Overall CD and MO Adjustment Method ................... 12

5-4-3. Overall CD and MO Adjustment Items ....................... 13

TABLE OF CONTENTS

6. DIAGRAMS ..................................................................... 14

6-1. IC Pin Description .............................................................. 14

6-1-1. IC801 RU6915MF-0006 (System Control) ................. 14

6-2. Block Diagrams .................................................................. 17

6-2-1. MD Block Diagram ..................................................... 17

6-2-2. Servo, System Control Block Diagram ....................... 19

6-3. Printed Wiring Boards and Schematic Diagrams ................ 21

6-3-1. Printed Wiring Board Main Board ........................ 21

6-3-2. Schematic Diagram Main Board (1/4) .................. 25

6-3-3. Schematic Diagram Main Board (2/4) .................. 27

6-3-4. Schematic Diagram Main Board (3/4) .................. 29

6-3-5. Schematic Diagram Main Board (4/4) .................. 31

6-4. IC Block Diagrams ............................................................. 33

7. EXPLODED VIEWS ..................................................... 37

7-1. Main Unit Section ............................................................... 37

7-2. Mechanism Deck Section ................................................... 38

8. ELECTRICAL PARTS LIST ...................................... 39

1) When repairing this device with the power on, if you remove

the main board or open the upper panel assy, this device stops

working.

In this case, you can work without the device stopping by

fastening the hook of the OPEN/CLOSE switch (MAIN board

S809) with tape.

2) This set is designed to perform automatic adjustment for each

adjustment and write its value to EEPROM. Therefore, when

EEPROM (MAIN board IC802) has been replaced in service,

be sure to perform automatic adjustment and write resultant

values to the new EEPROM.

Refer to section 4 Test Mode (page 10) for details.

SECTION 1

SERVICING NOTE

MAIN board S809

SECTION 2

GENERAL

This section is extracted from

instruction manual.