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MDCT-1000
US Model
SERVICE MANUAL
MD CONFER-TRANSCRIBER
Sony Corporation
Personal Audio Company
Shinagawa Tec Service Manual Production Group
9-873-186-02
2001G1600-1
© 2001.7
SPECIFICATIONS
Ver 1.1 2001. 07
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation
Model Name Using Similar Mechanism
MDCC-2000
MD Mechanism Type
CCMD-2000
Optical Pick-up Mechanism Type
KMS-250A
Laser diode properties
Material: GaAlAs
Wavelength: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6
µW
(This output is the value measured at a distance of
about 200 mm from the lens surface on the optical
pick-up block with 7 mm aperture.)
Revolutions
400 rpm to 1,800 rpm (CLV)
Error correction
Advanced Cross Interleave Reed Solomon Code (ACIRC)
Sampling frequency
44.1 kHz
Coding
ATRAC 3 (Adaptive TRansform Acoustic Coding 3)
Modulation system
EFM (Eight to Fourteen Modulation)
Number of channels
2 or 4 monaural channels
Frequency response
50­10,000 Hz
Speaker
Approx. 5.0 cm (2 inches) dia.
Power output
600 mW (at 10% distortion)
Output
EAR (minijack)
for 8­300
earphones
Other connector
CONTROL UNIT connector
Power requirements
12 V DC
DC IN 12V jack accepts the supplied AC power
adaptor for use on 120 V AC, 60 Hz
Dimensions
Approx. 320 x 280 x 118 mm (w/h/d)
(125/8 x 111/8 x 43/4 inches)
including projecting parts and controls
Mass
Approx. 3.7 kg (8 lb 3 oz)
Accessories supplied
AC power adaptor (1)
AC power cord (1)
Design and specifications are subject to change without notice.


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2
MDCT-1000
1. GENERAL ·········································································· 4
2. DISASSEMBLY
2-1.
Cabinet(Upper) Section ················································ 6
2-2.
Switch Section ······························································ 7
2-3.
LCD Section ································································· 7
2-4.
MD Section ·································································· 8
2-5.
Volume Section ···························································· 8
2-6.
Main Board ·································································· 9
2-7.
Door ··········································································· 10
2-8.
MD Board ·································································· 10
2-9.
Base Unit Section ······················································· 11
2-10. BUM-F1 Board ·························································· 11
2-11. REC/PB Head Assy (HR901) Section ······················ 12
2-12. Holder Assy, Cartridge Section ·································· 12
2-13. Holder Assy, Cartridge Installation ···························· 13
2-14. Optical Pick-Up (KMS-250A) Section ······················ 13
3. TEST MODE ···································································· 14
4. ELECTRICAL ADJUSTMENTS ······························· 26
5. DIAGRAMS
5-1.
Circuit Boards Location ············································· 27
5-2.
Block Diagrams ·························································· 28
MD Section ································································ 28
I/O Section ································································· 29
FIFO Section ······························································ 30
CPU Section ······························································· 31
LCD Section ······························································· 32
5-3.
Printed Wiring Board MD Section ··························· 33
5-4.
Schematic Diagram MD Section (1/4) ····················· 34
5-5.
Schematic Diagram MD Section (2/4) ····················· 35
5-6.
Schematic Diagram MD Section (3/4) ····················· 36
5-7.
Schematic Diagram MD Section (4/4) ····················· 37
5-8.
Schematic Diagram BUM Section ··························· 38
5-9.
Printed Wiring Board BUM Section ························ 39
TABLE OF CONTENTS
5-10. Schematic Diagram Main Section (1/11) ················· 40
5-11. Schematic Diagram Main Section (2/11) ················· 41
5-12. Schematic Diagram Main Section (3/11) ················· 42
5-13. Schematic Diagram Main Section (4/11) ················· 43
5-14. Schematic Diagram Main Section (5/11) ················· 44
5-15. Schematic Diagram Main Section (6/11) ················· 45
5-16. Schematic Diagram Main Section (7/11) ················· 46
5-17. Schematic Diagram Main Section (8/11) ················· 47
5-18. Schematic Diagram Main Section (9/11) ················· 48
5-19. Schematic Diagram Main Section (10/11) ··············· 49
5-20. Schematic Diagram Main Section (11/11) ··············· 50
5-21. Printed Wiring Board Main Section ························· 51
Main Section (1/4) ····················································· 52
Main Section (2/4) ····················································· 53
Main Section (3/4) ····················································· 54
Main Section (4/4) ····················································· 55
5-22. Schematic Diagram Audio Section ·························· 56
5-23. Printed Wiring Board Audio Section ························ 57
5-24. Schematic Diagram Level Meter Section ················· 58
5-25. Printed Wiring Board Level Meter Section ·············· 59
5-26. Schematic Diagram LCD Section ···························· 60
5-27. Printed Wiring Board LCD Section ························· 61
5-28. Schematic Diagram Switch Section ························· 62
5-29. Printed Wiring Board Switch Section ······················ 63
5-30. Schematic Diagram Foot Switch Section ················· 64
5-31. Printed Wiring Board Foot Switch Section ·············· 65
5-32. IC Pin Function Description ······································ 66
5-37. IC Block Diagrams ····················································· 69
6. EXPLODED VIEWS
6-1.
Cabinet Section ·························································· 76
6-2.
Key Section ································································ 77
6-3.
LCD Section ······························································· 78
6-4.
MD Mechanism Section (CCMD-2000) ···················· 79
7. ELECTRICAL PARTS LIST ······································· 80
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED LINEWITH
MARK
!ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270°C during
repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.


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3
MDCT-1000
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
· Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.


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4
MDCT-1000
SECTION 1
GENERAL
This section is extracted from
instruction manual.
Location and Function of Controls
For details, refer to the pages indicated in ( ).
1
LCD display
2
3
Built-in speaker
MONITOR VOL control
4
LCD CONTRAST control
Adjusts the contrast of the display.
5
MONITOR select buttons (ALL/1/2/3/4) (8)
6
STANDBY switch
7
MD insertion slot
8
Z
EJECT button
9
FUNCTION button
q;
DISP MODE button (10)
qa
Arrow buttons
qs
ENTER button
qd
Jog dial
qf
x
STOP button
qg
m
REW/BS button
qh
u
PLAY/PAUSE button
qj
M
FF/FS button
Left side
Rear
qk
CONTROL UNIT connector (11)
ql
EAR jack (8)
w;
DC IN 12V jack (7)


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5
MDCT-1000
1
Status display (17)
Indicates the disc inserted in or the status of
deck as follows:
BLANK: a blank disc
NO DISC: no disc
PB ONLY: a commercially available recorded
disc (for playback only)
PROTECTED: a protected disc
RECORDED: a recorded disc
2
3
TIME display
Indicates the recorded time at the current
location for each index item.
(copied) display
Indicates that a disc digitally copied on MDCC-
2000 is inserted.
4
INDEX counter
Lights up when a disc is inserted.
Blinks during an index search. (9)
5
END display
This shows the end of the disc.
6
Disc status display
Indicates the status of the disc with pictures.
7
Message display
Indicates various data by characters and various
error messages. (17)
8
Disc position display
Indicates the current playback location on the
disc by a white box. Already recorded parts are
indicated in black. The further it is to the right,
the closer the disc is to the end. Depending on the
condition of the disc, the black part might not
reach the far right even if the disc is full.
Display Window (Information screen)
1
2
3
4
5
6
7
8