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ICD-BP100/BP120
US Model
ICD-BP100/BP120
Canadian Model
AEP Model
UK Model
E Model
ICD-BP100
Tourist Model
ICD-BP100/BP120
SERVICE MANUAL
IC RECORDER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
Photo : ICD-BP100
SPECIFICATIONS
Ver 1.1 2002. 07
Recording media
Built-in flash memory, Monaural recording
Recording time
ICD-BP100: SP: 63 minutes, LP: 168 minutes
ICD-BP120: SP: 127 minutes, LP: 339 minutes
Frequency response
SP: 250 Hz - 7,300 Hz
LP: 300 Hz - 3,500 Hz
Speaker
approx. 3.2 cm (1 5/16 in.) dia.
Power output
300 mW
Input/Output
· Earphone jack (minijack) for 16 - 300 ohms
earphone/headphones
·Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
· USB connector
Playback speed control
FAST +30%, SLOW ­15%
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5
× 105.3 × 14.0 mm (1 13/16 × 41/4 × 9/16 in.)
Mass (incl. batteries)
79 g (2.79 oz)
Supplied accessories
Earphone
× 1
Carrying case
× 1
LR03 (size AAA) alkaline battery
× 2 (U.S.A. model
only)
Connecting cable
× 1 (ICD-BP100 only)
"Digital Voice Editor" (CD-ROM)
× 1
Registration card
× 1 (U.S.A. and European models
only)
Optional accessories
Electret Condenser Microphone ECM-Z60, ECM-
T115
Earphone MDR-ED228LP, MDR-E818LP
Connecting cord RK-G64
Your dealer may not handle some of the above listed optional accessories. Please
ask the dealer for detailed information.
Design and specifications are subject to change without notice.
9-873-072-12
2002G1600-1
© 2002.07


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2
TABLE OF CONTENTS
ICD-BP100/BP120
1. GENERAL ·································································· 3
2. DISASSEMBLY
2-1. Sub Block Assy, Upper Lid ············································· 4
2-2. F-SW Board ···································································· 4
2-3. Main Board, P-SW Board ··············································· 5
2-4. PC Board ········································································· 5
3. DIAGRAMS
3-1. Block Diagram ································································ 7
3-2. Printed Wiring Board ­ Main Section (1/2) ­ ················· 8
3-3. Printed Wiring Board ­ Main Section (2/2) ­ ················· 9
3-4. Schematic Diagram ­ Main Section (1/3) ­ ·················· 10
3-5. Schematic Diagram ­ Main Section (2/3) ­ ·················· 11
3-6. Schematic Diagram ­ Main Section (3/3) ­ ·················· 12
3-7. Schematic Diagram ­ F-SW Section ­ ························· 13
3-8. Printed Wiring Board ­ F-SW Section (1/2) ­ ·············· 14
3-9. Printed Wiring Board ­ F-SW Section (2/2) ­ ·············· 15
3-10. Printed Wiring Board ­ PC Section ­ ························· 16
3-11. Schematic Diagram ­ PC Section ­ ···························· 17
3-12. Printed Wiring Board ­ P-SW Section ­ ···················· 18
3-13. Schematic Diagram ­ P-SW Section ­ ······················· 19
3-14. IC Block Diagrams ····················································· 20
3-15. IC Pin Function Description ······································· 21
4. EXPLODED VIEWS
4-1. Upper Lid Assy Section ················································ 23
4-2. Main Board Section ······················································ 24
5. ELECTRICAL PARTS LIST ·································· 25
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270
°C during
repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
* Replacement of IC109 used in this set requires a special tool.
· The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.
· Lead layouts
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
· Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
surface
Lead layout of
conventional IC
CSP (chip size package)


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ICD-BP100/BP120
SECTION 1
GENERAL
This section is extracted from
instruction manual.
1
MIC (built-in microphone)
(12)
2
Display window (64)
3
FOLDER button (12, 16)
4
INDEX/BOOKMARK
button (22, 26)
5
DISPLAY button (39)
6
A-B REPEAT/PRIORITY
button (23, 30)
7
MENU button (10, 32, 35, 40,
41)
8
ERASE button (20)
9
xSTOP button (13, 17)
q;
Speaker
qa
MIC (PLUG IN POWER)
jack (15)
qs
EAR (earphone) jack (14, 17)
qd
OPR (operation) indicator
(12, 17)
qf
zREC (record) /STOP
button (13, 24)
qg
X PAUSE button (13, 17)
qh
.REVIEW/>CUE (fast
backward, review/fast
forward, cue·selection of
menu mode) button (10, 16,
18, 19, 22, 26, 30, 32, 35, 40,
41)
qj
NxPLAY/STOP
·EXECUTE (play/
stop·enter) button (10, 17,
18, 29, 30, 32, 35, 40, 41)
qk
HOLD switch (38)
ql
VOL (volume) control (17)
w;
USB connector for
connecting to a computer
(48)
qa
qs
qd
qf
qg
qh
qj
qk
ql
w;
q;
9
8
7
6
5
4
3
2
1
Main unit
Rear
wh
wg
wf
wa
ws
wd
wa
PLAY SPEED selector (18)
ws
MIC SENS (microphone
sensitivity) selector (14)
wd
VOR selector (15)
wf
Clip*
wg
Battery compartment (8)
wh
Hook for handstrap (not
supplied)


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ICD-BP100/BP120
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1.
SUB BLOCK ASSY, UPPER LID
r
Disassemble the unit in the order as shown below.
F-SW board
MAIN board, P-SW board
Sub block assy,upper lid
Set
PC board
2-2.
F-SW BOARD
2
3
F-SW board
1
connector (CN703)
case assy
4
5
sub block assy, upper lid
1
screw (B1.7
× 10)
2
screw (B1.7
× 7)
3
Remove the soldering
case assy


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5
ICD-BP100/BP120
2-3.
MAIN BOARD, P-SW BOARD
2-4.
PC BOARD
3
4
Main board
6
P-SW board
5
Remove the soldering
1
screw (1.7
× 4)
claw
case assy
2
connector
(CN802)
claw
2
1
screw (1.7
× 4)
3
PC board
case assy