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HCD-VX3A
E Model
Tourist Model
SERVICE MANUAL
MINI Hi-Fi COMPONENT SYSTEM
MICROFILM
Manufactured under license from Dolby Laboratories
Licensing Corporation.
"DOLBY" and the double-D symbol
aare trademarks
of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism HCD-VX5A/VX5AJ/VX7A
CD
CD Mechanism Type
CDM38L-5BD34L
Section
Base Unit Name
BU-5BD34L
Optical Pick-up Name
KSS-213D/Q-RP
Tape deck
Model Name Using Similar Mechanism HCD-GRX30
Section
Tape Transport Mechanism Type
TCM-230AWR2/230PWR2
-- Continued on next page --
SPECIFICATIONS
HCD-VX3A is the Amplifier, CD player,
Tape Deck and Tuner section in MHC-VX3.
Amplifier section
The following measured at AC 110, 220 V 50/60 Hz
DIN power output (rated)
60+60 W
(6
at 1 kHz, DIN)
Continuous RMS power output (reference)
80+80 W
(6
at 1 kHz, 10 % THD)
The following measured at AC 120, 240 V 50/60 Hz
DIN power output (rated)
70 + 70 W
(6
at 1 kHz, DIN)
Continuous RMS power output (reference)
100+100 W
(6
at 1 kHz, 10 % THD)
Inputs
MD/VIDEO (AUDIO) IN: voltage 450 mV/250 mV,
(phono jacks)
impedance 47 k
MIX MIC:
sensitivity 1 mV,
(phono jack)
impedance 10 k
Outputs
MD/VIDEO (AUDIO) OUT:
(phono jacks)
voltage 250 mV
impedance 1 k
PHONES:
accepts headphones of 8
or more
(stereo mini jack)
SPEAKER:
accepts impedance of 6 to 16
SUPER WOOFER:
voltage 1 V, impedance 1 k
VIDEO CD/CD player section
System
Compact disc, digital audio and
video system
Laser
Semiconductor laser
(
=780nm)
Emission duration: continuous
Laser output
Max. 44.6
µW*
*This output is the value measured at a distance
of 200 mm from the objective lens surface on the
Optical Pick-up Block with 7 mm aperture.
Frequency response
2 Hz-20 kHz (±0.5 dB)
Wavelength
780-790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format NTSC, PAL
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
-18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40-13,000 Hz (
±3 dB),
(DOLBY NR OFF)
using Sony TYPE I casette
40-14,000 Hz (
±3 dB),
using Sony TYPE II casette
Wow and flutter
±0.15 % W.Peak (IEC)
0.1
% W.RMS (NAB)
±0.2 % W.Peak (DIN)


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2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED LINE WITH
MARK
! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5-108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75
unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
2 Band type:
531-1,602 kHz
(with the interval set at 9 kHz)
530-1,710 kHz
(with the interval set at 10 kHz)
3 Band type:
Middle Eastern models:
MW:
531-1,602 kHz
(with the interval set at 9 kHz)
SW:
5.95-17.90 MHz
(with the interval set at 5 kHz)
Other models:
MW:
531-1,602 kHz
(with the interval set at 9 kHz)
530-1,710 kHz
(with the interval set at 10 kHz)
SW:
5.95-17.90 MHz
(with the interval set at 5 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Thailand models:
220-240 V AC, 50/60 Hz
Other models:
110-120 V or 220-240 V AC, 50/60 Hz
Power consumption
110 W
Dimensions (w/h/d)
Approx. 280
× 340 × 380 mm
(11
× 133/8 × 15 in.)
Mass:
Approx. 9.5 kg
(21 lb.)
Supplied accessories:
AM loop antenna (1)
Remote commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Video connecting cable (1)
Design and specifications are subject to change without notice.


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TABLE OF CONTENTS
1.
Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.
Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.
Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4.
Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5.
Check the B+ voltage to see it is at the values specified.
6.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270°C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the
following safety checks before releasing the set to the
customer.
1.
SERVICING NOTES ··················································· 4
2.
GENERAL ······································································ 5
3.
DISASSEMBLY
3-1.
Case ···················································································· 7
3-2.
Front Panel Section ···························································· 7
3-3.
Tape Mechanism Deck Section
(TCM-230AWR2/230PWR2) ············································ 8
3-4.
CD Mechanism Deck section (CDM38L-5BD34L) ·········· 8
3-5.
Main Board ········································································· 9
4.
TEST MODE ································································ 10
5.
MECHANICAL ADJUSTMENTS ·························· 13
6.
ELECTRICAL ADJUSTMENTS ··························· 13
7.
DIAGRAMS
7-1.
Circrit Boards Location ···················································· 18
7-2.
Block Diagrams ································································ 19
· CD Section····································································· 19
· Video Section ································································· 20
· Tape Deck Section ························································· 21
· Main Section ·································································· 22
· Display/Key Con Section ·············································· 23
7-3.
Printed Wiring Board Main Section ······························· 25
7-4.
Schematic Diagram Main Section (1/4) ························· 26
7-5.
Schematic Diagram Main Section (2/4) ························· 27
7-6.
Schematic Diagram Main Section (3/4) ························· 28
7-7.
Schematic Diagram Main Section (4/4) ························· 29
7-8.
Printed Wiring Board CD Section ·································· 30
7-9.
Schematic Diagram CD Section ····································· 31
7-10. Printed Wiring Board CD Motor Section ······················· 32
7-11. Schematic Diagram CD Motor Section ·························· 33
7-12. Printed Wirint Board Tape Deck Section ······················· 34
7-13. Schematic Diagram Tape Deck Section ························· 35
7-14. Printed Wiring Board Panel Section ······························· 36
7-15. Schematic Diagram Panel Section ································· 37
7-16. Printed Wiring Board AC Sec Standby Section ············· 38
7-17. Schematic Diagram AC Sec Standby Section ················ 39
7-18. Printed Wiring Board Leaf SW Section ························· 40
7-19. Schematic Diagram Leaf SW Section ···························· 40
7-20. Printed Wiring Board CD SW Section ··························· 41
7-21. Schematic Diagram CD SW Section ······························ 41
7-22. Printed Wiring Board Video Section ······························ 42
7-23. Schematic Diagram Video Section (1/3) ························ 43
7-24. Schematic Diagram Video Section (2/3) ························ 44
7-25. Schematic Diagram Video Section (3/3) ························ 45
7-26. IC Block Diagrams ··························································· 46
7-27. IC PIN Function Description ············································ 49
8.
EXPLODED VIEWS
8-1.
Case Section ····································································· 58
8-2.
Front Panel Section ·························································· 59
8-3.
Chassis Section ································································· 60
8-4.
CD Mechanism Deck Section-1 (CDM38L-5BD34L) ···· 61
8-5.
CD Mechanism Deck Section-2 (CDM38L-5BD34L) ···· 62
8-6.
Base Unit Section (BU-5BD32L) ····································· 63
8-7.
TC Mechanism Section-1(TCM-230AWR2/230PWR2) · 64
8-8.
TC Mechanism Section-2(TCM-230AWR2/230PWR2) · 65
9.
ELECTRICAL PARTS LIST ··································· 66


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4
SECTION 1
SERVICING NOTES
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH TURNS OFF.
NOTE FOR INSTALLATION (ROTARY ENCODER)
1 Remove the Case.
3 Pull-out the disc tray.
2 Turn the cam to the
direction of arrow.
BU cam
Groove
Section A
Note:When attaching the Base unit, Insert the
section A into the groove of BU cam.
Note:When attaching the BU cam,
engage the Rotary encoder
switch as shown in the figure.


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1
3
26
7
4
5
8
9
0
!TM
!
@TM
@
1 I/u button
2 (STANDBY)/DEMO button
3 DISC 1 button
4 DISC 2 button
5 DISC 3 button
6 DISC SKIP/EX-CHANGE button
7 § button
8 ( (TAPE B) button
9 p button
0 ^ (CD) button
!¡ TUNER/BAND button
!TM REC PAUSE/START button
!£ HI-DUB button
!¢ CD SYNC button
! Phones jack
!§ VOLUME nob
!¶ )+ button
!· =+ dial
!ª 0­ button
@º CD FLASH button
@¡ CD LOOP button
@TM MIC 2 jack
@£ MIC 1 jack
@¢ MIC LEVEL nob
@ ECHO LEVEL nob
@§ FUNCTION button
@¶ 9 (TAPE A) button
@· ( (TAPE A) button
@ª 9 (TAPE B) button
SECTION 2
GENERAL