1
HCD-GRX80/RXD8/RXD8S
AEP Model
HCD-RXD8/RXD8S
UK Model
HCD-RXD8
E Model
Australian Model
HCD-GRX80
SPECIFICATIONS
Photo: HCD-RXD8 (SILVER)
COMPACT DISC DECK RECEIVER
-- Continued on next page --
Model Name Using Similar Mechanism HCD-GRX8/R800/RX88/RX99
CD Mechanism Type
CDM38LH-5BD32L
Base Unit Type
BU-5BD32L
Optical Pick-up Type
KSS-213D/Q-N
Model Name Using Similar Mechanism HCD-GRX8/R800/RX88/RX99
Tape Transport Mechanism Type
TCM-230AWR1/230PWR1
CD
SECTION
TAPE DECK
SECTION
MICROFILM
SERVICE MANUAL
HCD-GRX80/RXD8/RXD8S is the
tuner, deck, CD and amplifier section
in MHC-GRX80/RXD8/RXD8S.
2
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of soldering iron around 270°C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED LINE
WITH MARK
! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
This caution
label is located
inside the unit.
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NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the "S curve check" in "CD section adjustment" and check
that the S curve waveform is output four times.
4-214-451-0
GRX80: E2, AR
MALAYSIA
4-214-451-1
GRX80: EA3
MALAYSIA
4-214-451-2
GRX80: SP
MALAYSIA
4-214-451-3
GRX80: MX
INDONESIA
4-214-451-4
GRX80: MX
MALAYSIA
4-214-451-5
GRX80: AUS
MALAYSIA
4-214-451-6
GRX80: TW
MALAYSIA
4-214-451-7
GRX80: E2
INDONESIA
4-214-451-8
GRX80: EA4, TH
THAILAND
4-214-451-9
GRX80: E3
MALAYSIA
4-217-515-2
GRX80: E3
INDONESIA
4-217-515-3
GRX80: EA3
INDONESIA
4-215-165-0
GRX8: AEP, G, CIS, UK
INDONESIA
4-215-165-2
GRX8S: AEP
INDONESIA
4-215-165-3
GRX8: AEP
MALAYSIA
MODEL IDENTIFICATION
-- BACK PANEL --
· Abbreviation
G
: German model
MX
: Mexican model
SP
: Singapore model
TW
: Taiwan model
AUS : Australian model
TH
: Thai model
EA3 : Saudi arabia model
EA4 : Israel model
E2
: Without SW tuner E model
E3
: With SW tuner E model
Parts No.
PARTS No.
MODEL
PRODUCT
COUNTRY
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TABLE OF CONTENTS
1. SERVICING NOTE .......................................................... 5
2. GENERAL .......................................................................... 6
3. DISASSEMBLY
3-1. Loading Panel ....................................................................... 8
3-2. Front Panel ............................................................................ 8
3-3. Cassette Lid and Tape Mechanism ........................................ 9
3-4. CD SW Board and Panel Board ............................................ 9
3-5. Disc Tray ............................................................................. 10
4. SERVICE MODE ............................................................ 11
5. MECHANICAL ADJUSTMENTS .......................... 14
6. ELECTRICAL ADJUSTMENTS ............................... 14
7. DIAGRAMS
7-1. Circuit Boards Location ...................................................... 18
7-2. Block Diagrams
· CD Section ....................................................................... 19
· Deck Section .................................................................... 21
· Main Section .................................................................... 23
· Main Power/Sub Power Section ...................................... 25
· Display Section ................................................................ 27
7-3. Printed Wiring Board BD (CD) Section ....................... 31
7-4. Schematic Diagram BD (CD) Section .......................... 33
7-5. Printed Wiring Board Main Section .............................. 35
7-6. Schematic Diagram Main (1/4) Section ........................ 37
7-7. Schematic Diagram Main (2/4) Section ........................ 39
7-8. Schematic Diagram Main (3/4) Section ........................ 41
7-9. Schematic Diagram Main (4/4) Section ........................ 43
7-10. Printed Wiring Board Leaf SW Section ..................... 45
7-11. Schematic Diagram Leaf SW Section ........................ 46
7-12. Schematic Diagram Deck Section .............................. 47
7-13. Printed Wiring Board Deck Section ........................... 49
7-14. Printed Wiring Board Panel Section ........................... 51
7-15. Schematic Diagram Panel (1/3) Section ..................... 53
7-16. Schematic Diagram Panel (2/3) Section ..................... 55
7-17. Schematic Diagram Panel (3/3) Section ..................... 57
7-18. Schematic Diagram CD Motor Section ...................... 59
7-19. Printed Wiring Board CD Motor Section ................... 61
7-20. Schematic Diagram Trans Section ............................. 63
7-21. Schematic Diagram Sub Trans Section ...................... 65
7-22. Printed Wiring Board Trans Section ........................... 67
7-23. Printed Wiring Board Sub Trans Section ................... 68
7-24. IC Block Diagrams ........................................................... 69
7-25. IC Pin Functions ............................................................... 70
8. EXPLODED VIEWS
8-1. Case Section ........................................................................ 73
8-2. Chassis Section ................................................................... 74
8-3. Front Panel Section ............................................................. 75
8-4. CD Mechanism Deck Section-1 (CDM38LH-5BD32L) .... 76
8-5. CD Mechanism Deck Section-2 (CDM38LH-5BD32L) .... 77
8-6. Base Unit Section (BU-5BD32L) ....................................... 78
8-7. TC Mechanism Section-1 (TCM230AWR1/230PWR1) .... 79
8-8. TC Mechanism Section-2 (TCM230AWR1/230PWR1) .... 80
9. ELECTRICAL PARTS LIST ........................................ 81
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CD-TEXT
This unit is provided with a simple CD-TEXT display function.
The CD-TEXT contents of 20 tracks are displayed on the fluorescent display tube.
Since the function is simple, some special characters may not be displayed, or may be displayed as other characters.
SECTION 1
SERVICING NOTE
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH
TURNS OFF
Note for Installation (ROTARY ENCODER)
3 Pull-out the disc tray.
1 Remove the Case.
2 Turn the cam to the direction
of arrow.
BU cam
Groove
Section A
Note:When attaching the Base unit, Insert the
section A into the groove of BU cam.
Note:When attaching the BU cam,
engage the Rotary encoder
switch as shown in the figure.