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HCD-BX3/DX3
US Model
Canadian Model
AEP Model
UK Model
HCD-BX3
E Model
Australian Model
HCD-DX3
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
MICROFILM
-- Continued on next page --
SPECIFICATIONS
· HCD-BX3/DX3 is the tuner, deck,
CD and amplifier section in MHC-
BX3/DX3.
Photo: HCD-BX3
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM58-K2BD38
Section
Base Unit Name
BU-K2BD38
Optical Pick-up Name
KSM-213DAP
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
TCM-230MWR11
AUDIO POWER SPECIFICATIONS:
(HCD-BX3 US model only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
with 6 ohm loads both channels driven, from 120-10,000 Hz; rates
75 watts per channel minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwatts to rated output.
Amplifier section
US, Canadian model:
HCD-BX3:
Continuous RMS power output (reference)
60 + 60 watts
(6 ohms at 1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 35 W)
AEP, UK model:
HCD-BX3:
DIN power output (rated) 45 + 45 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
60 + 60 watts
(6 ohms at 1 kHz, 10% THD)
Music power output (reference)
150 + 150 watts
(6 ohms at 1 kHz, 10% THD)
Other model:
HCD-DX3:
The following measured at AC 120, 220, 240 V 50/60 Hz
DIN power output (rated) 75 + 75 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
100 + 100 watts
(6 ohms at 1 kHz, 10% THD)
Inputs
MD/VIDEO IN:
voltage 450/250 mV,
(phono jacks)
impedance 47 kilohms
MIC:
sensitivity 1 mV,
(mini jack)
impedance 10 kilohms
Outputs
PHONES:
accepts headphones of
(stereo mini jack)
8 ohms or more
SPEAKER:
accepts impedance of 6 to 16 ohms
CD player section
System
Compact disc and digital audio system
Laser
Semiconductor laser (
=780 nm)
Emission duration: continuous
Laser output
Max. 44.6
µW*
*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
Ver 1.0 2000.1


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SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
SAFETY CHECK-OUT
(US model only)
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, "metallized" knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2.
A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The "limit" indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
Earth Ground
AC
voltmeter
(0.75V)
1.5k
0.15
µF
Fig. A. Using an AC voltmeter to check AC leakage.
To Exposed Metal
Parts on Set
Wavelength
780 ­ 790 nm
Frequency response
2 Hz ­ 20 kHz (±0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
­18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 ­ 13,000 Hz (±3 dB), using Sony TYPE I
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 ­ 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
US, Canadian, Mexican, Argentina models:
530 ­ 1,710 kHz
(with the interval set at 10 kHz)
531 ­ 1,710 kHz
(with the interval set at 9 kHz)
AEP, Saudi Arabia models:
531 ­ 1,602 kHz
(with the interval set at 9 kHz)
Other models:
531 ­ 1,602 kHz
(with the interval set at 9 kHz)
530 ­ 1,710 kHz
(with the interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
US, Canadian models:
120 V AC, 60 Hz
AEP model:
230 V AC, 50/60 Hz
Australian model:
230-240 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 - 240 V AC, 50/60 Hz
Adjustable with voltage selector
Power consumption
US model:
HCD-BX3:
140 watts
Canadian model:
HCD-BX3:
130 watts
AEP model:
HCD-BX3:
130 watts
Other models:
HCD-DX3:
170 watts
Dimensions (w/h/d)
HCD-BX3/DX3:
Approx. 280 x 325 x 403 mm
Mass
US model:
HCD-BX3:
Approx. 7.8 kg
Canadian model:
HCD-BX3:
Approx. 7.8 kg
AEP model:
HCD-BX3:
Approx. 7.9 kg
Other models:
HCD-DX3:
Approx. 8.9 kg
Design and specifications are subject to change without notice.


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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of soldering iron around 270°C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
TABLE OF CONTENTS
MODEL IDENTIFICATION
-- BACK PANEL --
MODEL
BX3: AEP, UK, G, AED models
DX3: AR, E, EA, SP, TW, MY models
BX3: US, CND models
DX3: AUS, KR, MX, TH models
BX3: CIS model
PARTS No.
4-224-547-0s
4-224-547-1s
4-224-547-2s
4-224-547-4s
4-226-245-0s
· Abbreviation
CND : Canadian model
AUS
: Australian model
G
: German model
AED
: North European model
EA
: Saudi Arabia model
MY
: Malaysia model
PARTS No.
1. SERVICE NOTE ······························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBY ·································································· 7
4. TEST MODE ···································································· 12
5. MECHANICAL ADJUSTMENTS ····························· 16
6. ELECTRICAL ADJUSTMENTS ······························· 16
7. DIAGRAMS
7-1. Circuit Board Location ················································· 21
7-2. Block Diagrams ···························································· 22
7-3. Printed Wiring Board
BD Section ···························· 24
7-4. Schematic Diagram
BD Section ······························· 25
7-5. Printed Wiring Board
Main Section ························· 26
7-6. Schematic Diagram
Main Section (1/3) ··················· 27
7-7. Schematic Diagram
Main Section (2/3) ··················· 28
7-8. Schematic Diagram
Main Section (3/3) ··················· 29
7-9. Printed Wiring Board
AMP Section ························· 30
7-10. Schematic Diagram
AMP Section ·························· 31
7-11. Printed Wiring Board
Panel Section ······················· 32
7-12. Schematic Diagram
Panel Section ·························· 33
7-13. Printed Wiring Board
Leaf SW Section ·················· 34
7-14. Schematic Diagram
Leaf SW Section ···················· 35
7-15. Printed Wiring Board
Driver Section ······················ 36
7-16. Schematic Diagram
Driver Section ························ 37
7-17. Printed Wiring Board
Trans Section ······················· 38
7-18. Schematic Diagram
Trans Section ·························· 39
7-19. IC Pin Function Description ······································· 40
7-20. IC Block Diagrams ····················································· 42
8. EXPLODED VIEWS
8-1. Main Section ································································· 45
8-2. Panel Section ································································ 46
8-3. Main Board Section ······················································ 47
8-4. Tape Mechanism Section ·············································· 48
8-5. CD Mechanism Section ················································ 49
9. ELECTRICAL PARTS LIST ······································· 50
SP
: Singapore model
TH
: Thai model
TW
: Taiwan model
KR
: Korea model
MX
: Mexican model
AR
: Argentina model


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SECTION 1
SERVICE NOTE
Screw hole
Attach the panel board with
fourteen screws (+BVTP 2.6
× 8 )
after the board is removed once.
Do not tighten the screws excessively.
1
Cut the fourteen melted-connection points with a cutting plier.
Note for installing the panel board
2
Panel board
Hot melt


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SECTION 2
GENERAL
12 3
4 5
6
7
8
9
q;
qa
qs
qd
qf
qg
qh
qj
qk
ql
w;
wa
ws
wd
wf
wg
wh
wj
wk
wl
e;
ea
es
1
­ . button
2
x button
3
gG button
4
S button
5
> + button
6
PLAY MODE button
7
REPLAY button
8
EDIT button
9
VOLUME knob
q;
PHONE jack
qa
OPEN/CLOSE button
qs
DISC 3 button
qd
DISC 2 button
qf
DISC 1 button
qg
DISC SKIP EX-CHANGE button
qh
CURSOL button
qj
MIC jack
qk
MIC LEVEL knob
ql
SPECTRUM button
w;
DISPLAY button
wa
@/1 button
ws
MD/VIDEO button and indicator
wd
TAPE A/B button and indicator
wf
CD button and indicator
wg
TUNER/BAND button and indicator
wh
CROOVE button and indicator
wj
SURROUND button and indicator
wk
CD SYNC HI-DUB button
wl
REC PAUSE/START button and indicator
e;
KARAOKE PON button
ea
ENTER button
es
EQ EDIT button
Photo: HCD-BX3