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DP-IF4000
US Model
Canadian Model
AEP Model
E Model
SERVICE MANUAL
DIGITAL SURROUND PROCESSOR
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-879-299-02
2005B02-1
© 2005.02
SPECIFICATIONS
Ver. 1.1 2005. 02
Decoder functions
Dolby Digital
Dolby Pro Logic II
DTS
MPEG-2 AAC
Virtual surround function
OFF
CINEMA
MUSIC
Compression function
OFF
ON
Modulation System
DQPSK-IM
Secondary carrier wave frequency
3.75 MHz
Transmission distance
Approx. 7 m (23 ft) to the front
Transmission range
12 ­ 24,000 Hz
Distortion rate
1% or less (1 kHz)
Audio inputs
Optical input
(rectangular-type) x 1
Analogue input (pin jack left/right) x 1
Audio output
Optical output (rectangular-type) x 1
Power requirements
DC 9 V (from the supplied AC power
adaptor)
Dimensions
Approx. 160 x 160 x 200 mm
(6 3/8 x 6 3/8 x 7 7/8 in) (w/h/d)
Mass Approx. 400 g
(15 oz)
Design and specifications are subject to change without notice.
· The DP-IF4000 is the digital surround
processor that comprises the MDR-DS4000.
· MDR-DS4000 consists of the following models respectively.
Cordless stereo headphone
MDR-IF4000
Digital surround processor
DP-IF4000
* The digital surround processor for this system incorporates the Dolby Digital decoder, the Dolby Pro Logic II
decoder, the DTS decoder and the MPEG-2 AAC decoder.
Manufactured under licence from Dolby Laboratories and Digital Theater Systems, Inc.
"Dolby," "Pro Logic," the "AAC" logo and the double-D symbol are trademarks of Dolby Laboratories.
"DTS" and "DTS VIRTUAL " are trademarks of Digital Theater Systems, Inc.


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2
DP-IF4000
TABLE OF CONTENTS
Specifications ............................................................................ 1
1.
GENERAL ................................................................... 3
2.
DISASSEMBLY
2-1.
Disassembly Flow ........................................................... 5
2-2.
Cabinet (Lower), Luminous Window, IF Board .............. 5
2-3.
TX Board ......................................................................... 6
3.
ELECTRICAL ADJUSTMENT ............................. 7
4.
DIAGRAMS
4-1.
Block Diagrams ............................................................... 9
4-2.
Printed Wiring Board ­ IF Board Section ­ .................... 10
4-3.
Schematic Diagram ­ IF Board Section ­ ....................... 11
4-4.
Printed Wiring Board ­ TX Board Section (Side A) ­ .... 12
4-5.
Printed Wiring Board ­ TX Board Section (Side B) ­ .... 13
4-6.
Schematic Diagram ­ TX Board Section (1/2) ­ ............ 14
4-7.
Schematic Diagram ­ TX Board Section (2/2) ­ ............ 15
4-8.
IC Pin Function Descriptions .......................................... 16
5.
EXPLODED VIEWS
5-1.
Processor Section ............................................................ 21
6.
ELECTRICAL PARTS LIST .................................. 22
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
·Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
· Repaier DP-IF4000 with MDR-IF4000.


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3
DP-IF4000
SECTION 1
GENERAL
This section is extracted
from instruction manual.
LOCATING THE CONTROLS
Front Panel of the Processor
INPUT
SELECT
ANALOG
DIGITAL
EFFECT
MUSIC
OFF
CINEMA
COMPRESSION OFF
ON
4
5
6
3
2
1
1
COMPRESSION switch
2
EFFECT switch
Slide to select the sound field (OFF/
CINEMA/MUSIC).
3
INPUT SELECT switch
Slide to select the input source
(DIGITAL/ANALOG).
4
CHG indicator
Lights red while charging.
5
Infrared emitter
Set the emitter in a position so that there
is a straight, unobstructed path to the
sensor.
6
DECODE MODE indicator


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4
DP-IF4000
Rear Panel of the Processor
ATT
LINE IN
DIGITAL
IN
L
0dB
-8dB
R
DC IN 9V
OUT
1
2
3
4
5
1
ATT (attenuator) switch
Set this switch to Ò0dBÓ if the volume is
too low at analogue input. Normally, this
switch should be set to ÒÐ8dB.Ó
2
LINE IN jacks
Connect the audio output jacks on audio
or video component (sold separately),
such as a video cassette player or TV, to
these jacks.
3
DIGITAL IN jack
Connect a DVD player, Digital
Broadcasting Satellite Receiver, or other
digital component (sold separately) to this
jack.
4
DIGITAL OUT jack
Connected components' digital signal
integrity retained when installed.
5
DC IN 9V jack
Connect the supplied AC power adaptor
to this jack. (Be sure to use the supplied
ACpower adaptor. Using products with
different plug polarity or other
characteristics can cause a malfunction.)


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5
DP-IF4000
SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
2-2.
CABINET (LOWER), LUMINOUS WINDOW, IF BOARD
· This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-2. CABINET (LOWER), LUMINOUS WINDOW,
IF BOARD
(Page 5)
2-3. TX BOARD
(Page 6)
SET
qa
connector
(CN502)
qs
connector
(CN501)
q;
IF board
1
rubber foot (back)
2
two screws (B2.6)
8
two screws
(+B2.6)
9
two screws
(+B2.6)
6
two screws (B2.6)
4
cabinet (lower)
5
indication window assy
7
luminous window
3
screw (B2.6)
cabinet (upper)