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D-EJ119/EJ120/EJ121
US Mpdel
Canadian Mode
D-EJ120
AEP Model
D-EJ119/EJ120
E Model
D-EJ120/EJ121
Australian Model
D-EJ121
SERVICE MANUAL
PORTABLE CD PLAYER
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
9-879-350-04
2005D02-1
© 2005.04
SPECIFICATIONS
Ver. 1.3 2005.04
Photo : D-EJ121
Model Name Using Similar Mechanism
D-EJ100/EJ101/EJ101CK/EJ106CK
CD Mechanism Type
CDM-3325ERV
Optical Pick-up Name
DAX-25EV
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength:
= 780 nm
Emission duration: Continuous
Laser output: Less than 44.6
µW (This output is the value measured at a
distance of 200 mm from the objective lens surface on the optical pick-up
block with 7 mm aperture.)
Power requirements
· Two LR6 (size AA) batteries: 1.5 V DC x 2
· AC power adaptor (DC IN 4.5 V jack):
220 V, 50 Hz (Model for China)
120 V, 60 Hz (Model for Mexico)
Dimensions (w/h/d) (without projecting parts and controls)
Approx. 135.8 x 28.2 x 135.8 mm (5 3/8 x 1 1/8 x 5 3/8 in.)
Mass (excluding accessories)
Approx. 180 g (6.4 oz)
Operating temperature
5
°C - 35°C (41°F - 95°F)
Supplied Accessories
D-EJ119
D-EJ120
D-EJ121
AC power
a*1
a*1, *2
a
adaptor (1)
Headphones/
aa
a
earphones (1)
Remote control (1)
­
a*3
a
*1 Not supplied with U.K. model
*2 Not supplied with US, Latin American and Canadian models
*3 Supplied with European, Canadian and Latin American models
Design and specifications are subject to change without notice.


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2
D-EJ119/EJ120/EJ121
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270
°C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
·Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
· Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
· Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
CAUTION
·INVISIBLE LASER RADIATION WHEN OPEN
· DO NOT STARE INTO BEAM OR VIEW DIRECTLY
WITH OPTICAL INSTRUMENTS
·CLASS 1M INVISIBLE LASER RADIATION WHEN OPEN
· DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
Notes on the AC power adaptor
· Use only the supplied AC power adaptor. Do not use
any other AC power adaptor.
· Connect the AC power adaptor to an easily accessible
AC outlet. Should you notice an abnormality in the AC
power adaptor, disconnect it from the AC outlet
immediately.
· Do not touch the AC power adaptor with wet hands.
Polarity of
the plug
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Specifications ............................................................................ 1
1.
SERVICING NOTE ................................................... 3
2.
GENERAL ................................................................... 4
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 5
3-2.
Upper Lid Assy, Cabinet (Upper) Assy,
Cabinet (Lower) Assy ...................................................... 5
3-3.
CD Mechanism Deck (CDM-3325ERV), Main Board ... 6
3-4.
Motor Assy (Sled) (M901), Optical Pick-Up
(DAX-25EV), Turn Table Motor Assy
(Spindle) (M902) ............................................................. 7
4.
ELECTRICAL ADJUSTMENT ............................. 8
5.
DIAGRAMS
5-1.
Block Diagrams ............................................................... 9
5-2.
Printed Wiring Boards ­ Main Board (Side A) ­ ............ 10
5-3.
Printed Wiring Boards ­ Main Board (Side B) ­ ............ 11
5-4.
Schematic Diagram ­ Main Board (1/3) ­ ...................... 12
5-5.
Schematic Diagram ­ Main Board (2/3) ­ ...................... 13
5-6.
Schematic Diagram ­ Main Board (3/3) ­ ...................... 14
5-7.
IC Pin Function Description ............................................ 18
6.
EXPLODED VIEWS
6-1.
Upper Lid Section ........................................................... 20
6-2.
Cabinet Section ................................................................ 21
6-3.
Optical Pick-Up Section (CDM-3325ERV) .................... 22
7.
ELECTRICAL PARTS LIST .................................. 23
TABLE OF CONTENTS
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Ver. 1.2


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3
D-EJ119/EJ120/EJ121
SECTION 1
SERVICING NOTE
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the "Optical
Pick-Up Block Checking Procedures" (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
· FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
· RF signal P-to-P value: 0.45 to 0.65 Vp-p
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S809. (push switch type)
The following checking method for the laser diode is operable.
· Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S809 with a screwdriver having a
thin tip as shown in Fig.1.
3. Press the u button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power control
circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Fig. 1 Method to push the S809
S809
lever(lid detection)
lever(lid detection)
MAIN board
TEST MODE
The software version display and LCD test can be performed when
the test mode is activated.
Procedure:
1. Confirm the set is not powered on. (Remove two batteries and
disconnect the AC power adaptor.)
2. Short the solder land SL801 (TEST) on the MAIN board.
3. Turn on the main power. (Insert two batteries.)
4. Microcomputer version is displayed for about a second.
5. After that all segments of the liquid crystal display are turned
on.
6. Turn off the main power. (Remove two batteries.)
7. Open the solder land SL801 (TEST) on the MAIN board.
Note : The solder should be removed clean.
IC801
SL801
(TEST)
MAIN BOARD (SIDE B)


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4
D-EJ119/EJ120/EJ121
SECTION 2
GENERAL
This section is extracted
from instruction manual.
*The button has a tactile dot.
Display
4
.
/>
2
u*
1
SOUND
6
PMODE/
7
DISPLA Y/MENU
DC IN 4.5 V (external power
input) jack
i
(headphones) jack
5
x
3
HOLD (rear)
Strap hole
8
VOL +*/­
A
OPEN


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5
D-EJ119/EJ120/EJ121
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-2. UPPER LID ASSY, CABINET (UPPER) ASSY, CABINET (LOWER) ASSY
z
The equipment can be removed using the following procedure.
3-3. CD MECHANISM DECK (CDM-3325ERV),
MAIN BOARD
(Page 6)
SET
3-2. UPPER LID ASSY,CABINET (UPPER) ASSY,
CABINET (LOWER) ASSY
(Page 5)
3-4. MOTOR ASSY (SLED) (M901),
OPTICAL PICK-UP (DAX-25EV),
TURN TABLE MOTOR ASSY (SPINDLE) (M902)
(Page 7)
HOW TO SET THE HARNESS IN ASSEMBLING
(Page 6)
4
tow screws
upper lid assy
cabinet (upper) assy
cabinet (lower) assy
5
claw
7
CN802
3
five screws
1
6
2
5
claw
5
claw
3-1.
DISASSEMBLY FLOW