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Model Name Using Similar Mechanism
CDX-C7850R
CD Drive Mechanism Type
MG-363S-121
Optical Pick-up Name
KSS-521A
SERVICE MANUAL
AEP Model
UK Model
CDX-C8850R
FM/MW/LW COMPACT DISC PLAYER
CD player section
System
Compact disc digital audio
system
Signal-to-noise ratio
98 dB
Frequency response
10 - 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
Tuning range
87.5 - 108.0 MHz
Aerial terminal
External aerial connector
Intermediate frequency 10.7 MHz
Usable sensitivity
8 dBf
Selectivity
75 dB at 400 kHz
50 dB at 200 kHz
Signal-to-noise ratio
65 dB (stereo),
68 dB (mono)
Harmonic distortion at 1 kHz
0.7% (stereo),
0.4% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 - 15,000 Hz
MW/LW
Tuning range
MW : 531 - 1,602 kHz
LW : 153 - 281 kHz
Aerial terminal
External aerial connector
Intermediate frequency 10.71 MHz / 450 kHz
Sensitivity
MW : 30 µV
LW : 50 µV
Power amplifier section
Outputs
Speaker outputs
(sure seal connectors)
Speaker impedance
4 - 8 ohms
Maximum power output 45 W
× 4 (at 4 ohms)
SPECIFICATIONS
General
Outputs
Line outputs (3)
Power aerial relay control
lead
Power amplifier control
lead
Telephone ATT control
lead
Illumination control
lead
Equalizer
±12 dB; f0 = 62 Hz, 157 Hz,
396 Hz, 1.0 kHz, 2.5 kHz,
6.34 kHz, 16 kHz
Power requirements
12 V DC car battery
(negative ground)
Dimensions
Approx. 178
× 50 × 182 mm
(w/h/d)
Mounting dimension
Approx. 182
× 53 × 163 mm
(w/h/d)
Mass
Approx. 1.4 kg
Supplied accessories
Rotary commander RM-X4V (1)
Microphone (1)
Parts for installation and
connections (1 set)
Front panel case (1)
Design and specifications are subject to change without
notice.
MICROFILM


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TABLE OF CONTENTS
1. GENERAL
Location of controls ................................................................. 3
Getting Started ......................................................................... 3
Setting the clock ...................................................................... 3
CD Player ................................................................................ 4
Radio ....................................................................................... 5
RDS ......................................................................................... 5
Voice Drive .............................................................................. 7
Voice Memo ............................................................................. 7
DSP .......................................................................................... 7
Other Functions ....................................................................... 9
CD/MD Unit ............................................................................ 9
Additional Information .......................................................... 11
Connections ........................................................................... 13
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................. 16
2-2. Mechanism Block ............................................................. 16
2-3. Main Board, Power Board ................................................. 17
2-4. Heat Sink ........................................................................... 17
2-5. Chassis (T) Sub Assy ........................................................ 18
2-6. Lever Assy ......................................................................... 18
2-7. Servo Board ....................................................................... 19
2-8. Roller Assy ........................................................................ 19
2-9. Chassis (OP) (O/S) Assy ................................................... 20
2-10. Optical Pick-up Block ....................................................... 20
3. ELECTRICAL ADJUSTMENTS
Tuner Section ......................................................................... 21
4. DIAGRAMS
4-1. IC Pin Descriptions ........................................................... 25
4-2. Block Diagram ­CD Section­ ........................................... 37
4-3. Block Diagram ­Display Section­ .................................... 38
4-4. Block Diagram ­Tuner Section­ ....................................... 39
4-5. Circuit Boards Location .................................................... 40
4-6. Schematic Diagram ­CD Mechanism Section (1/3)­ ....... 41
4-7. Schematic Diagram ­CD Mechanism Section (2/3)­ ....... 42
4-8. Schematic Diagram ­CD Mechanism Section (3/3)­ ....... 43
4-9. Printed Wiring Boards ­CD Mechanism Section­ ............ 44
4-10. Printed Wiring Board ­Main Section­ .............................. 46
4-11. Schematic Diagram ­Main Section (1/5)­ ........................ 48
4-12. Schematic Diagram ­Main Section (2/5)­ ........................ 49
4-13. Schematic Diagram ­Main Section (3/5)­ ........................ 50
4-14. Schematic Diagram ­Main Section (4/5)­ ........................ 51
4-15. Schematic Diagram ­Main Section (5/5)­ ........................ 52
4-16. Schematic Diagram ­Power Section­ ............................... 53
4-17. Printed Wiring Board ­Power Section­ ............................ 54
4-18. Printed Wiring Board ­Relay Section­ ............................. 55
4-19. Schematic Diagram ­Relay Section­ ................................ 56
4-20. Schematic Diagram ­Display Section­ ............................. 57
4-21. Printed Wiring Board ­Display Section­ .......................... 58
5. EXPLODED VIEWS
5-1. Chassis Section ................................................................. 66
5-2. Front Panel Section ........................................................... 67
5-3. CD Mechanism Section (1) ............................................... 68
5-4. CD Mechanism Section (2) ............................................... 69
5-5. CD Mechanism Section (3) ............................................... 70
6. ELECTRICAL PARTS LIST ........................................ 71
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
! OR DOTTED LINE
WITH MARK
! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
Notes on Chip Component Replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
MODEL IDENTIFICATION
The destination is expressed with the model according to the
language of CSV (Computer Sound Voice) mounted in the set.
How to identify the model is described below.
­ POWER BOARD (side A) ­
IC803
MSM534001E-49TSKFDR3 (TYPE A : ENGLISH, FRENCH)
MSM534001E-50TSKFDR3 (TYPE B : ENGLISH, SPANISH)
MSM534001E-51TSKFDR3 (TYPE C : ENGLISH, GERMAN)


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SECTION 1
GENERAL
This section is extracted
from instruction manual.


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